Device for Measurement and Analysis of Electrical Signals of an Integrated Circuit Component
Abstract
According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) ( 1 ), through which signals ( 4, 5, 6 ) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit ( 7,8 ), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip ( 15 to 20 ) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.
Claims
exact text as granted — not AI-modified1 . An integrated circuit, comprising:
a plurality of inaccessible circuit points; a first externally accessible contact; and a multiplexer connected to said contact and said plurality of circuit points; wherein said integrated circuit provides a reference signal and electrical signals at said inaccessible circuit points.
2 . An integrated circuit according to claim 1 , wherein said multiplexer selectively couples one of said circuit points to said first contact.
3 . An integrated circuit according to claim 1 , further comprising a second externally accessible contact, wherein said multiplexer is connected to said second contact.
4 . An integrated circuit according to claim 3 , further comprising a second multiplexer, wherein said second multiplexer selectively passes said electrical signals to one of said first externally accessible contact and said second externally accessible contact.
5 . An integrated circuit according to claim 1 , wherein said reference signal is adapted to be monitored for test purposes.
6 . An integrated circuit according to claim 1 , wherein said electrical signals are internal chip signals, and said reference signal is used to monitor the timing of said internal chip signals.
7 . An integrated circuit according to claim 1 , wherein said integrated circuit is formed as part of a package, wherein said first externally accessible contact is disposed on said package.
8 . An integrated circuit according to claim 1 , wherein said multiplexer is time-controlled.
9 . An integrated circuit according to claim 1 , wherein said first externally accessible contact can receive inputting signals to said plurality of inaccessible circuit points.
10 . An integrated circuit, comprising:
a plurality of inaccessible circuit points; a first externally accessible contact and a second externally accessible contact; and a multiplexer connected to said first and second externally accessible contacts and said plurality of circuit points, wherein said integrated circuit provides a reference signal and electrical signals at said circuit points.
11 . An integrated circuit according to claim 10 , further comprising a second multiplexer, wherein the second multiplexer selectively passes said electrical signals to said first and second externally accessible contacts.
12 . An integrated circuit according to claim 10 , wherein said electrical signals are internal chip signals, and said reference signal is used to monitor the timing of said internal chip signals.
13 . An integrated circuit according to claim 10 , further comprising a package, wherein said first externally accessible contact is disposed on said package.
14 . An integrated circuit according to claim 10 , wherein said first externally accessible contacts can receive inputting signals to said plurality of inaccessible circuit points.
15 . A method of providing access to externally inaccessible circuit points on an integrated circuit comprising:
providing a first externally accessible contact on said integrated circuit; and providing a multiplexer connected to said contact and said plurality of circuit points, wherein said integrated circuit provides a reference signal and electrical signals.
16 . A method according to claim 15 , wherein said electrical signals and said reference signal are monitored for test purposes.
17 . A method according to claim 15 , further comprising monitoring the timing of said electrical signals using said reference signal.
18 . A method according to claim 15 , further comprising providing a second externally accessible contact, said multiplexer being connected to said second contact.
19 . A method according to claim 18 , further comprising providing a second multiplexer and selectively passing said electrical signals to said first and second contacts via said second multiplexer.
20 . A method according to claim 15 , further comprising time-controlling said multiplexer.
21 . A method according to claim 15 , further comprising inputting signals to said plurality of inaccessible circuit points via said first externally accessible contact.Join the waitlist — get patent alerts
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