Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Abstract

An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.

1 . A surface mount shield wall component for providing side wall shielding for an electronic module and suitable for connection to a top conductive shield of said electronic module, said surface mount shield wall component comprising:
 at least one conductive shield wall section suitable for attachment to a conductive circuit board pad of said electronic module;   a non-conductive portion, including a non-conductive sacrificial portion, attached to said at least one conductive shield wall section;   wherein said conductive shield wall section provides said side wall shielding and is suitable for connection to said top conductive shield.   
   
   
       2 . The surface mount shield wall component of  claim 1  wherein said surface mount shield wall component is positioned on a circuit board panel by an SMT pick and place process. 
   
   
       3 . The surface mount shield wall component of  claim 1  wherein said non-conductive portions provides mechanical stability for said surface mount shield wall component during an overmolding process. 
   
   
       4 . The surface mount shield wall component of  claim 1  wherein said non-conductive portion lies in a saw street between two adjacent module circuit boards on a circuit board panel, so as to facilitate removal of said sacrificial portion by sawing. 
   
   
       5 . The surface mount shield wall component of  claim 1  wherein said electronic module is substantially overmolded with a mold compound so as to form an overmolded electronic module. 
   
   
       6 . The surface mount shield wall component of  claim 5  wherein said mold compound is removed from a top portion of said at least one conductive shield wall section so as to expose said top portion for connection to said top conductive shield. 
   
   
       7 . The surface mount shield wall component of  claim 6  wherein said top conductive shield is placed on said overmolded electronic module for connection to said at least one conductive shield wall section. 
   
   
       8 . The surface mount shield wall component of  claim 1  wherein said conductive circuit board pad is coupled to a ground plane of a module circuit board supporting said electronic module. 
   
   
       9 . The surface mount shield wall component of  claim 1  wherein said conductive circuit board pad is coupled to a package pin of said electronic module, said package pin being coupled to a ground plane of a module circuit board supporting said electronic module. 
   
   
       10 . An overmolded electronic module comprising:
 a plurality of SMT shield wall components arranged on periphery of a module circuit board;   at least one integrated circuit situated in said module circuit board;   a top conductive shield connected to an exposed top portion of at least one of said plurality of SMT shield wall components.   
   
   
       11 . The overmolded electronic module of  claim 10  further including at least one passive SMT component situated in said module circuit board. 
   
   
       12 . The overmolded electronic module of  claim 10  wherein said top conductive shield is situated on a mold compound encapsulating said electronic module, and wherein said exposed top portion is not covered by said mold compound. 
   
   
       13 . The overmolded electronic module of  claim 10  wherein said at least one of said plurality of SMT shield wall components includes a conductive shield wall section. 
   
   
       14 . The overmolded electronic module of  claim 13  wherein an exposed top portion of said conductive shield wall section is connected to said top conductive shield. 
   
   
       15 . The overmolded electronic module of  claim 13  wherein said conductive shield wall section is attached to a conductive circuit board pad of said module circuit board. 
   
   
       16 . The overmolded electronic module of  claim 15  wherein said conductive circuit board pad is coupled to a ground plane of said module circuit board. 
   
   
       17 . The overmolded electronic module of  claim 13  wherein said conductive shield wall section comprises tin plated copper. 
   
   
       18 . The overmolded electronic module of  claim 10  wherein at least one additional SMT shield wall component is situated inside said module circuit board. 
   
   
       19 . The overmolded electronic module of  claim 10  wherein said mold compound comprises a polymer resin.