Electronic device

Abstract

An electronic device includes a first die that includes wires for bonding, a second die that includes an array of balls for bonding, and a substrate. The substrate includes bond sites for wires from the first die, and bond sites for the array of balls from the second die. The wires of first die are coupled to the bond sites for wires of the substrate. The balls of the second die are coupled to the bond sites for the array of balls of the substrate.

1 . A method for plating a substrate having a first major surface and a second major surface, the method comprising: 
 forming a wire bond pad on at least one of the first major surface and the second major surface;    plating the wire bond pad to a thickness sufficient for bonding a wire to the wire bond pad;    forming a further pad on at least one of the first major surface and the second major surface; and    plating the further pad with a lesser thickness than the wire bond pad, the further pad having a thickness sufficient to receive a ball from a ball grid array device.    
   
   
       2 . The method of  claim 1  further comprising masking portions of the first major surface and the second major surface to allow plating on the wire bond pad and to prevent plating on the further pad.  
   
   
       3 . The method of  claim 2  wherein the plating on the wire bond pad is electrolytic plating.  
   
   
       4 . The method of  claim 2  wherein plating the wire bond pad includes placing the wire bond pad in an electrolytic solution.  
   
   
       5 . The method of  claim 2  wherein plating the wire bond pad includes: 
 plating a layer of nickel from a first electrolytic solution; and    plating a layer of gold from a second electrolytic solution.    
   
   
       6 . The method of  claim 1  further comprising masking the wire bond pad on one of the first major surface and the second major surface to allow plating on the other pad on one of the first major surface and the second major surface.  
   
   
       7 . The method of  claim 6  wherein the plating the further pad includes electroless plating.  
   
   
       8 . The method of  claim 6  wherein plating the further pad includes: 
 an electroless plating of nickel; and    an electroless plating of gold.