Heat dissipation system for solarlok photovoltaic interconnection system

Abstract

A heat dissipation system for a photovoltaic array (PV) interconnection system includes an enclosure containing one or more diode elements. A heat pipe system has heat sinks attached to one or both ends. The heat pipe passes through the enclosure in thermal contact with the diode assemblies. Cooling fins are arranged on the heat sink such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the enclosure to cool the components within the enclosure.

1 . A heat dissipation system for a photovoltaic array interconnection system comprising:
 an enclosure, at least one diode element, a heat pipe system and at least one heat sink attached to at least one end of the heat pipe system, the enclosure including at least one aperture for inserting power cables;   wherein the heat pipe system is in thermal communication with the at least one diode element, and the heat pipe system penetrating at least one wall of the enclosure between the diode and the heat sink, the heat sink being disposed on an exterior of the enclosure; and at least one cooling fin arranged on the heat sink such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to an ambient atmosphere on an exterior of the enclosure.   
     
     
         2 . The system of  claim 1 , wherein the heat pipe system penetrates the enclosure at a first and a second opposing sides 
     
     
         3 . The system of  claim 2 , wherein both ends of the heat pipe system being attached to one of the heat sinks. 
     
     
         4 . The system of  claim 1 , wherein the diodes and the heat sinks are bonded to the heat pipe system by a thermally conductive adhesive. 
     
     
         5 . The system of  claim 1 , wherein the heat pipe system is bonded with the heat sink by one of the following: embedding the pipe in the heat sink, threading the heat pipe system into the heat sink, soldering or brazing. 
     
     
         6 . The system of  claim 1 , wherein the heat sinks having a plurality of fins connected by a base portion in thermal communication therewith, the fins arranged on the base portion to provide airflow paths for transferring heat from the heat sink to the ambient air. 
     
     
         7 . The system of  claim 1 , wherein the heat pipe having an internal liquid, a wick and a container, arranged such that the liquid is repeatedly condensed by the heat sink, returned by capillary action to an interior of the enclosure, and evaporated within the enclosure by heat absorbed from the diodes. 
     
     
         8 . The system of  claim 1 , wherein the diode elements being arranged in tandem in a plurality of rows, and having one heat pipe system and at least one heat sink for each row of diode elements. 
     
     
         9 . The system of  claim 1 , wherein the heat pipe system being configured in a non-linear shape corresponding to a nonlinear configuration of diode elements. 
     
     
         10 . The system of  claim 9 , wherein the nonlinear shape is selected from a U-shape, a W-shape or an S-shape. 
     
     
         11 . The system of  claim 1 , wherein the enclosure includes a plurality of electrical connectors for connecting conductors of a PV array. 
     
     
         12 . The system of  claim 11 , wherein the enclosure also includes a plurality of cable couplers comprising sealed penetrations for the external connection of electrical cables. 
     
     
         13 . The system of  claim 12 , wherein cable couplers have high voltage and high current carrying capacity, and are in conformance with the International Protection (IP) standard IP-67. 
     
     
         14 . The system of  claim 1 , wherein the at least one aperture is disposed on the underside of the enclosure in the area opposite of the cable couplers. 
     
     
         15 . The system of  claim 1 , wherein the enclosure also includes at least one additional component, the additional component selected from the group consisting of: diode assemblies, jumper wires or printed circuit board. 
     
     
         16 . The system of  claim 1 , wherein the heat pipe system extends through the enclosure in thermal contact with all of the diode assemblies. 
     
     
         17 . A connection box for a photovoltaic array interconnection system comprising:
 an enclosure, at least one diode element, a heat pipe system and at least one heat sink attached to at least one end of the heat pipe system, the enclosure including at least one aperture for inserting at least one power cable;   wherein the heat pipe system is in thermal communication with the at least one diode element, and the heat pipe system penetrating at least one wall of the enclosure between the diode and the heat sink, the heat sink being disposed on an exterior of the enclosure; and at least one cooling fin arranged on the heat sink such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the enclosure.   
     
     
         18 . The connection box of  claim 17 , wherein the enclosure is a component of a solar energy roof panel system comprising an array of PV cells arranged as a roof mounted system for conversion of solar energy to electrical power. 
     
     
         19 . The connection box of  claim 19 , wherein the enclosure includes a plurality of electrical connectors for connecting conductors of a PV array.