Electro-Optic Polymer Waveguide Devices Incorporating Organically Modified Sol-Gel Clads

Abstract

A method for making an optical device including establishing a temperature in a composition and applying an electric field to pole the core layer of the composition.

1 . A method for making an optical device comprising: 
 establishing a temperature in a composition including at least one buffer cladding and an electro-optic polymer core layer sufficient to reduce electrical resistivity of at least a portion of the buffer cladding; and    applying an electric field through the buffer cladding to pole the electro-optic polymer core layer.    
   
   
       2 . The method of  claim 1 , wherein the temperature is sufficient to enable a polymerization reaction in the electro-optic core.  
   
   
       3 . The method of  claim 2 , wherein the polymerization reaction includes a cross-linking reaction.  
   
   
       4 . The method of  claim 1 , wherein the temperature is about 180° C.  
   
   
       5 . The method of  claim 1 , wherein the buffer cladding includes an organically-modified sol-gel.  
   
   
       6 . The method of  claim 1 , wherein the buffer cladding is reduced to an electrical resistivity of 10 11  ohm·cm −1  or less.  
   
   
       7 . The method of  claim 1 , wherein after poling, the refractive index of the buffer cladding is lower than the refractive index of the core.  
   
   
       8 . The method of  claim 1 , wherein the electro-optic core layer is poled while the composition is at a temperature sufficient for a crosslinking polymerization reaction of the core layer and sufficient for a reduction in electrical resistivity of the buffer cladding.  
   
   
       9 . The method of  claim 1 , wherein the electric filed is applied through the buffer cladding and through a polymer cladding between the buffer cladding and core layer to pole the electro-optic polymer core layer.  
   
   
       10 . The method of  claim 1 , wherein the electrical field is applied using a corona, an electrode, or a push-pull apparatus.  
   
   
       11 . A method for making an optical device, comprising: 
 heating a composition including a buffer cladding including an organically modified sol-gel, a polymer cladding, and an electro-optic polymer core; and    applying an electric field through the buffer cladding and polymer cladding to pole the electro-optic polymer core.    
   
   
       12 . The method of  claim 11 , wherein the composition is heated to a temperature sufficient to crosslink the electro-optic polymer core.  
   
   
       13 . The method of  claim 11 , wherein the composition is heated to a temperature sufficient to lower the resistivity of the buffer cladding.  
   
   
       14 . The method of  claim 11 , further comprising applying a second polymer cladding and second buffer cladding.  
   
   
       15 . The method of  claim 14 , further comprising applying a metal layer on the second buffer cladding.  
   
   
       16 . The method of  claim 11 , further comprising applying a second buffer cladding.  
   
   
       17 . The method of  claim 11 , wherein the electro-optic core includes an organically-modified sol-gel.  
   
   
       18 . The method of  claim 11 , further comprising shaping the electro-optic polymer core.  
   
   
       19 . The method of  claim 14 , wherein the second polymer cladding includes an organically-modified sol-gel.  
   
   
       20 . A composition for use in making an optical device, comprising: 
 a conductive layer; and    a buffer cladding including an organically modified sol-gel.    
   
   
       21 . The composition of  claim 20 , further comprising a polymer cladding including an organically modified sol-gel adjacent to the buffer cladding.  
   
   
       22 . The composition of  claim 21 , wherein the polymer cladding includes an organically modified titania-siloxane sol-gel.  
   
   
       23 . The composition of  claim 20 , further comprising an adhesion promoter between the conductive layer and the buffer cladding.  
   
   
       24 . The composition of  claim 20 , wherein the conductive layer includes a metallic layer.  
   
   
       25 . The composition of  claim 20 , further comprising a semiconductor; and wherein the conductive layer is disposed on the semiconductor; and the buffer cladding is disposed on the conductive layer.