3D miniature preconcentrator and inlet sample heater

Abstract

The present invention relates to a three dimensional preconcentrator and inlet heater. The preconcentrator consists of a substrate with passageways, a conductive material coated to the top and the bottom of the substrate and an adsorbent coating covering the entire substrate. This substrate is suspended in a holding frame by a connecting bridge. The preconcentrator may also include a resistor and a proportional-integral-differential controller. The device may be used inline with a detector and can be retrofitted to existing devices. An array of preconcentrators may also be formed. The invention also relates to methods of use of the preconcentrator and methods of manufacture. A method of use includes contacting an analyte and a preconcentrator, allowing the analyte to adsorb to the preconcentrator and then desorbing the analyte. A method of manufacture involves applying the adsorbent coating by misted chemical deposition.

1 . A preconcentrator comprising:
 a substrate with passageways therethrough;   a conductive material covering the top and bottom of the substrate;   a top electrical lead connected to the conductive material covering the top of the substrate;   a bottom electrical lead connected to the conductive material covering the bottom of the substrate;   a first adsorbent coating on a first portion of the conductive material and the inside of the passageways.   a second absorbent coating on a second portion of the conductive material and the inside of the passageways.   
   
   
       2 . The preconcentrator of  claim 1 , wherein the substrate comprises silicon. 
   
   
       3 . The preconcentrator of  claim 1 , wherein the conductive material comprises a Ti barrier layer coated with Aluminium. 
   
   
       4 . The preconcentrator of  claim 1 , wherein one of the adsorbent coatings comprises polydimethylsiloxane. 
   
   
       5 . The preconcentrator of  claim 1  further comprising;
 a holding frame; and   a connecting bridge connecting the substrate to the holding frame.   
   
   
       6 . The preconcentrator of  claim 5 , wherein the holding frame and the connecting bridge comprises silicon. 
   
   
       7 . The preconcentrator of  claim 1 , wherein the preconcentrator is placed inline with a detector. 
   
   
       8 . The preconcentrator of  claim 1 , further comprising a temperature variable thin-film resistor. 
   
   
       9 . The preconcentrator of  claim 8 , further comprising a temperature-controlling proportional-integral-differential controller. 
   
   
       10 . The preconcentrator of  claim 1 , further comprising a support. 
   
   
       11 . The preconcentrator of  claim 10  wherein the support is selected from the group consisting of TEFLON®, ceramic or polyetheretherketone. 
   
   
       12 . An array preconcentrator comprising:
 two or more preconcentrators, each preconcentrator comprising:
 a substrate with passageways therethrough, 
 a conductive material covering the top and bottom of the substrate, 
 a top electrical lead connected to the conductive material covering the top of the substrate, 
 a bottom electrical lead connected to the conductive material covering the bottom of the substrate, and 
 an adsorbent coating on top of the conductive material and along the inside of the passageways wherein at least one preconcentrator is individually addressed electrically. 
   
   
   
       13 . The array preconcentrator of  claim 12 , wherein each preconcentrator selectively adsorbs a different analyte of interest. 
   
   
       14 . The array preconcentrator of  claim 12  further comprising
 a holding frame; and   a connecting bridge connecting each preconcentrator to the other and to the holding frame.   
   
   
       15 . The array preconcentrator of  claim 12 , wherein the substrate, holding frame and connecting bridge comprise silicon. 
   
   
       16 - 22 . (canceled) 
   
   
       23 . A method of manufacturing of a preconcentrator comprising the steps of:
 i) supplying a substrate;   ii) providing passageways through said substrate;   iii) coating the top and bottom of said substrate with a conductive material;   iv) coating a first portion of the conductive material and the inside of the passageways with a first adsorbent coating; and   v) coating a second portion of the conductive material and the inside of the passageways with a second absorbent coating.   
   
   
       24 . The method of  claim 23  further comprising attaching electrical leads to said conductive material. 
   
   
       25 - 26 . (canceled)