Particle-Reducing Load Lock Seal

Abstract

Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

1 . A device comprising:
 a chamber for use in a vacuum environment;   at least one shelf within the chamber for supporting one or more workpieces within the chamber;   an opening into the chamber for passage of one or more workpieces between the chamber and an outside environment, the opening including a door operable to selectively seal the opening, thereby isolating the environment within the chamber from an external environment; and   a baffle positioned between the opening and the at least one shelf to disperse a shock wave created when the door is opened.   
   
   
       2 . The device of  claim 1  wherein the baffle is moveable. 
   
   
       3 . The device of  claim 1  wherein the chamber is in a semiconductor manufacturing process module. 
   
   
       4 . The device of  claim 1  wherein the chamber is in a load lock. 
   
   
       5 . The device of  claim 1  wherein the chamber is in an equipment front end module. 
   
   
       6 . The device of  claim 1  wherein the door includes a slot valve. 
   
   
       7 . The device of  claim 1  further comprising a vacuum pump for evacuating the chamber. 
   
   
       8 . The device of  claim 1  further comprising a vent for venting the chamber. 
   
   
       9 . The device of  claim 1  further comprising a filter across the opening that prevents passage of particles into the chamber when the door is opened. 
   
   
       10 . The device of  claim 1  further comprising a filter across a gas line to the chamber that prevents transport of particles into the chamber during venting. 
   
   
       11 . The device of  claim 1  further comprising a filter across a gas line to the chamber that prevents transport of particles into the chamber during pumping. 
   
   
       12 . The device of  claim 1  further comprising a gas line to the chamber, the gas line including one or more irregular surfaces positioned to disperse a vacuum release shock wave. 
   
   
       13 . A device comprising:
 a chamber for use in a vacuum environment;   at least one shelf within the chamber for supporting one or more workpieces within the chamber;   an opening into the chamber for passage of one or more workpieces between the chamber and an outside environment, the opening including a door operable to selectively seal the opening, thereby isolating the environment within the chamber from an external environment; and   a baffle means for dispersing a shock wave created when the door is opened.   
   
   
       14 . The device of  claim 13  wherein the chamber is in a semiconductor manufacturing process module. 
   
   
       15 . The device of  claim 13  wherein the chamber is in a load lock. 
   
   
       16 . The device of  claim 13  wherein the chamber is in an equipment front end module. 
   
   
       17 . The device of  claim 13  wherein the door includes a slot valve. 
   
   
       18 . The device of  claim 13  further comprising a vacuum pump for evacuating the chamber. 
   
   
       19 . The device of  claim 13  further comprising a vent for venting the chamber. 
   
   
       20 . The device of  claim 13  further comprising a filter across the opening that prevents passage of particles into the chamber when the door is opened.