Miniature actuator integration for liquid cooling

Abstract

A device for cooling integrated circuits on circuit boards. A base placed proximate the element to be cooled contains an actuator that forces a cooling liquid through a plurality of channels that dissipate heat generated by the element. The base with the actuator, liquid and channels is sealed with a top. Preferred actuators are electric motors, and MEMS such as electrostatic actuators and piezoelectric actuators. The base has a large surface area relative to the thickness of the chamber The ratio of the surface area to thickness may range from about 40:1 to about 5:1.

1 . A device for cooling elements that generate heat, comprising:
 a base for defining a chamber, said base being adapted to be placed proximate the element to be cooled;   a coolant fluid in said chamber;   a micro/mini channel element in said chamber for directing flow of said coolant fluid through a plurality of channels or loops;   a miniature actuator integrated in said chamber for forcing said cooling fluid through said plurality of channels in said micro/mini channel element having a surface area to thereby dissipate heat generated by said element; and   a top for sealing said chamber and maintaining said coolant fluid inside said base.   
   
   
       2 . The device of  claim 1 , wherein said coolant fluid is a liquid. 
   
   
       3 . The device of  claim 2 , wherein said liquid is water. 
   
   
       4 . The device of  claim 1 , wherein said base is thermally conductive metal. 
   
   
       5 . The device of  claim 1 , wherein said actuator is an electric motor for operating in said fluid. 
   
   
       6 . The device of  claim 1 , wherein said actuator is an electrostatic actuator. 
   
   
       7 . The device of  claim 1 , wherein said actuator is a piezoelectric actuator. 
   
   
       8 . The device of  claim 1 , wherein said element to be cooled is an integrated circuit chip. 
   
   
       9 . The device of  claim 1 , wherein said base has a large surface area relative to the thickness of said chamber. 
   
   
       10 . The device of  claim 9 , wherein the ratio of said surface area to thickness ranges from about 40:1 to about 5:1. 
   
   
       11 . A device for cooling elements that generate heat, comprising:
 base means for defining a chamber, said base means being adapted to be placed proximate the element to be cooled;   a coolant fluid in said chamber;   micro/mini channel element means in said chamber for directing flow of said coolant fluid through a plurality of channels in said micro channel element means;   miniature actuator means integrated in said chamber for forcing said cooling fluid through said plurality of channels in said micro/mini channel element means having a surface area to thereby dissipate heat generated by said element; and   top means for sealing said chamber and maintaining said coolant fluid inside said base means.   
   
   
       12 . The device of  claim 11 , wherein said coolant fluid is a liquid. 
   
   
       13 . The device of  claim 12 , wherein said liquid is water. 
   
   
       14 . The device of  claim 11 , wherein said base means is formed from thermally conductive metal. 
   
   
       15 . The device of  claim 11 , wherein said actuator means is an electric motor for operating in said fluid. 
   
   
       16 . The device of  claim 11 , wherein said actuator means is an electrostatic actuator. 
   
   
       17 . The device of  claim 11 , wherein said actuator means is a piezoelectric actuator. 
   
   
       18 . The device of  claim 11 , wherein said element to be cooled is an integrated circuit chip. 
   
   
       19 . The device of  claim 11 , wherein said base means has a large surface area relative to the thickness of said chamber. 
   
   
       20 . The device of  claim 19 , wherein the ratio of said surface area to thickness ranges from about 40:1 to about 5:1.