Method of electroplating a plurality of conductive fingers

Abstract

A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair are substantially longitudinally oriented away from the edge. A trace electrically couples the pair of conductive fingers via a shortest path between the pair of conductive fingers. A plating bar is electrically coupled to one of the pair of conductive fingers and thereafter electroplating the pair of conductive fingers via the plating bar. Subsequent to electroplating, laser drilling the trace to electrically isolate the pair of conductive fingers.

1 . A circuit board comprising:
 a front conductive finger placed on a surface of the circuit board inset a first distance from an edge;   a rear conductive finger placed on the surface and inset a second distance from the edge, where the second distance is larger than the first distance;   a trace electrically coupling the front conductive finger to the rear conductive finger via a shortest path between the front conductive finger and the rear conductive finger;   a plating bar coupled to the front conductive finger, wherein the front conductive finger and the rear conductive finger are electroplated via the plating bar and wherein the trace is laser driller to electrically isolate the front conductive finger from the rear conductive finger.