Method for probing impact sensitve and thin layered substrate

Abstract

A method of moving a substrate to a probe card. The method comprises moving a probe card and a substrate vertically closer to one another employing dynamically changing velocities during the moving. More than two different velocities are used during the moving. The velocities are at zero only at an initial location and a final location. The moving is such that the probe card and the substrate contact each other with a soft impact. The velocities for the moving begin with a high velocity and reduce to a lower velocity so that the contact between the probe card and the substrate us a microtouch impact.

1 . A method for testing an electrical device comprising:
 moving a first structure and a substrate vertically closer to one another employing dynamically changing velocities during said moving, wherein more than two different velocities are used during said moving, and wherein velocities are at zero only at an initial location and a final location, wherein said moving is such that said first structure and said substrate contact each other with a soft impact.   
   
   
       2 . The method of  claim 1  wherein said velocities are varied continuously such that motions for said moving are continuous until the final location. 
   
   
       3 . The method of  claim 1  wherein parameters for varying said velocities are updated at least every 60 microsecond. 
   
   
       4 . A method comprising:
 placing a substrate on a substrate supporter provided in a cleaning chamber, said substrate supporter moveable in XYZ directions;   providing a first structure coupled to a chuck, said first structure having at least one component configured to perform a procedure on said substrate, said first structure being moveable in XYZ directions;   moving said first structure and said substrate supporter in the Z-direction toward one another using dynamically changing velocities during said moving, wherein a plurality of different velocities are used during said moving, wherein velocities are at zero only at an initial location and a final location, wherein said moving further includes moving said first structure and said substrate in the Z-direction toward one another at a fast velocity before said first structure and said substrate contact each other and impact at a slow velocity as said first structure and said substrate contact each other producing a microtouch impact.   
   
   
       5 . The method of  claim 4  wherein moving said first structure and said substrate toward one another further comprising:
 moving said substrate supporter in the Z-direction toward said first structure using the initial velocity of zero, a second velocity, a third velocity, and the final velocity of zero without stopping until a desired contact is achieved between said first structure and said substrate.   
   
   
       6 . The method of  claim 5  wherein said second velocity is faster than said third velocity. 
   
   
       7 . The method of  claim 6  further comprising:
 returning said substrate supporter to an initial position.   
   
   
       8 . The method of  claim 4  wherein moving said first structure and said substrate supporter toward one another further comprising:
 moving said first structure toward said substrate supporter using an initial velocity of zero, a second velocity, a third velocity, and a final velocity of zero without stopping until a desired contact between said first structure and said substrate is achieved.   
   
   
       9 . The method of  claim 8  wherein said second velocity is greater than said third velocity.