Method of manufacturing mems ics

Abstract

Methods of manufacturing an integrated circuit incorporating MEMS are provided. The methods include laying out the integrated circuit using a plurality of overlapping reticles.

1 . A method of manufacturing an integrated circuit incorporating MEMS, comprising laying out the integrated circuit using a plurality of overlapping reticles. 
     
     
         2 . A method according to  claim 1 , wherein the overlapping reticles are the same as each other. 
     
     
         3 . A method according to  claim 1 , wherein the reticles are different to each other. 
     
     
         4 . A method according to  claim 3 , wherein the reticles are different lengths. 
     
     
         5 . A method of manufacturing an integrated circuit printhead according to  claim 1 . 
     
     
         6 . A method of manufacturing a plurality of integrated circuits on a single substrate wafer, wherein each of the integrated circuits is manufactured in accordance with  claim 1 . 
     
     
         7 . A method according to  claim 6 , wherein at least some of the integrated circuits are different to each other. 
     
     
         8 . A method according to  claim 7 , wherein the integrated circuits are of different lengths. 
     
     
         9 . A method laying out an integrated circuit incorporating MEMS, the method including the steps of:
 defining a layout of an integrated circuit;   defining a joint path; and   modifying at least one element within an overlap area adjacent the joint path to take into account reticle field overlap during a subsequent manufacturing step.