US2008159904A1PendingUtilityA1
Solder alloy
Est. expiryAug 24, 2025(expired)· nominal 20-yr term from priority
C22C 13/00
52
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Claims
Abstract
An alloy suitable for use in a ball grid array or chip scale package, the alloy comprising from 0.05-1.5 wt. % copper; from 2.5-5 wt. % silver; one or both of from 0.005-0.3 wt % nickel and/or from 0.003-0.3 wt % chromium; from 0-0.1 wt. % phosphorus; from 0-0.1 wt. % germanium; from 0-0.1 wt. % gallium; from 0-0.3 wt. % of one or more rare earth elements; from 0-0.3 wt. % indium; from 0-0.3 wt. % magnesium; from 0-0.3 wt. % calcium; from 0-0.3 wt. % silicon; from 0-0.3 wt. % aluminium; from 0-0.3 wt. % zinc; from 0-2 wt. % bismuth; from 0-1 wt. % antimony; from 0-0.2 wt % manganese; from 0-0.3 wt % cobalt; from 0-0.3 wt % iron; and from 0-0.1 wt % zirconium; and the balance tin, together with unavoidable impurities.
Claims
exact text as granted — not AI-modified1 . An alloy suitable for use in a ball grid array or chip scale package, the alloy comprising:
from 0.05-1.5 wt. % copper; from 2.5-5 wt. % silver; one or both of from 0.005-0.3 wt % nickel and/or from 0.003-0.3 wt % chromium; from 0-0.1 wt. % phosphorus; from 0-0.1 wt. % germanium; from 0-0.1 wt. % gallium; from 0-0.3 wt. % of one or more rare earth elements; from 0-0.3 wt. % indium; from 0-0.3 wt. % magnesium; from 0-0.3 wt. % calcium; from 0-0.3 wt. % silicon; from 0-0.3 wt. % aluminium; from 0-0.3 wt. % zinc; from 0-2 wt. % bismuth; from 0-1 wt. % antimony; from 0-0.2 wt % manganese; from 0-0.3 wt % cobalt; from 0-0.3 wt % iron; and from 0-0.1 wt % zirconium; and the balance tin, together with unavoidable impurities.
2 . An alloy as claimed in claim 1 comprising from 0.02-0.3 wt % nickel.
3 . An alloy as claimed in claim 2 comprising from 0.02 to 0.2 wt % nickel.
4 . An alloy as claimed in claim 1 comprising from 0.005 to 0.3 wt % chromium.
5 . An alloy as claimed in claim 4 comprising from 0.01 to 0.2 wt % chromium.
6 . An alloy as claimed in claim 1 comprising from 0.1 to 1 wt. % Cu.
7 . An alloy as claimed in claim 6 comprising from 0.1 to 0.9 wt. % Cu.
8 . An alloy as claimed in claim 1 comprising from 3 to 4 wt. % Ag.
9 . An alloy as claimed in claim 8 comprising from 3 to 3.5 wt. % Ag.
10 . An alloy as claimed in claim 1 comprising from 0.02-0.2 wt. % of at least one of cobalt and iron.
11 . An alloy as claimed in claim 1 comprising from 0.01-0.3 wt. % magnesium.
12 . An alloy as claimed in claim 1 comprising from 0.02-0.3 wt. % iron.
13 . An alloy as claimed in claim 1 comprising from 0.01-0.15 wt. % manganese.
14 . An alloy as claimed in claim 1 comprising from 0.05-0.3 wt. % indium.
15 . An alloy as claimed in claim 1 comprising from 0.01-0.3 wt. % calcium.
16 . An alloy as claimed in claim 1 comprising from 0.01-0.3 wt. % silicon.
17 . An alloy as claimed in claim 1 comprising from 0.008-0.3 wt. % aluminium.
18 . An alloy as claimed in claim 1 comprising from 0.01-0.3 wt. % zinc.
19 . An alloy as claimed in claim 1 comprising from 0.05-1 wt. % antimony.
20 . An alloy as claimed in claim 1 comprising from 0.05 to 1 wt. % bismuth.
21 . An alloy as claimed in claim 1 , wherein said one or more rare earth elements comprises one or more elements selected from cerium, lanthanum, neodymium and praseodymium.
22 . An alloy as claimed in claim 1 comprising from 0.1 to 0.8 wt. % Cu, from 3 to 4 wt. % Ag, from 0.03 to 0.15 wt % nickel and/or from 0.01 to 0.07 wt % chromium.
23 . An alloy as claimed in claim 1 in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a preform, or a powder or paste (powder plus flux blend), or solder spheres for use in ball grid array joints, or a pre-formed solder piece.
24 . A soldered ball grid array or chip scale package joint comprising an alloy as defined in claim 1 .
25 . Use of an alloy as defined in claim 1 in a ball grid array or chip scale package.Cited by (0)
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