Strip Conductor Structure for Minimizing Thermomechanical Loads

Abstract

A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

1 . A semiconductor chip device, comprising:
 a surface on which at least one electrical contact surface is provided;   a foil, made from electrically insulating material, is provided on the surface, the foil including a window at the contact surface in which the contact surface is free of the foil and planar contact is established with at least, one layer made from electrically conducting material, whereby the layer, made from electrically conducting material, is part of a facility, which is mechanically flexible because of its geometry, for establishing the electrical connection between the contact surface and at least one outer connecting conductor, and whereby, originating from the layer made from electrically conducting material, at least one strip conductor running radially toward the outside extends by way of an outer strip conductor pinto the outer connecting conductor, the outer strip conductor framing the window and the outer connecting conductor being provided on the foil.   
   
   
       2 . A device made from a substrate with including a surface on which at least one electrical contact surface provided, whereby a foil made from electrically insulating material is provided on the surface, whereby the foil has a window at the contact surface in which the contact surface is free of the foil and planar contact is established with at least one layer made from electrically conducting material, whereby the layer, made from electrically conducting material, is part of a facility, which is mechanically flexible because of its geometry, for establishing the electrical connection between the contact surface and at least one outer connecting conductor, and whereby originating from the layer made from electrically conducting material, at least one strip conductor running radially toward the outside extends by way of an outer strip conductor into the outer connecting conductor, the outer strip conductor framing the window and the outer connecting conductor being provided on the foil. 
   
   
       3 . The device as claimed in  claim 2 , wherein at least one contact surface, which is at least one of an alternative and an addition to the contact surface on the substrate, on at least one semiconductor chip on the surface of the substrate, whereby a foil made from electrically insulating material is provided on the surface of the semiconductor chip, whereby the foil has a window at the contact surface on the semiconductor chip, in which this contact surface is free of the foil and planar contact is established with at least one layer made from electrically conducting material, whereby the layer made from electrically conducting material is part of a facility, which is mechanically flexible because of its geometry, for establishing the electrical connection between the contact surface and at least one outer connecting conductor, and whereby originating from the layer made from electrically conducting material, at least one strip conductor running radially toward the outside extends by way of an outer strip conductor into the outer connecting conductor the outer strip conductor framing the window and the outer connecting conductor being provided on the foil. 
   
   
       4 . The device as claimed in  claim 1 , wherein the area of the layer made from electrically conducting material is smaller than the contact surface. 
   
   
       5 . The device as claimed in  claim 1 , wherein at least one of at least three strip conductors running radially and at least one ring-shaped outer strip conductor is implemented. 
   
   
       6 . The device as claimed in  claim 1 , wherein the at least three strip conductors running radially have at least one angular bulge. 
   
   
       7 . The device as claimed in  claim 6 , wherein at least two angular bulges are oriented in the same circumferential direction. 
   
   
       8 . The device as claimed in  claim 1 , wherein, originating from the layer made from electrically conducting material, at least one strip conductor running radially in a spiral toward the outside extends into a ring-shaped outer strip conductor. 
   
   
       9 . The device as claimed in  claim 1 , wherein the layer made from electrically conducting material is implemented as a central area in a center of the contact surface. 
   
   
       10 . The device as claimed in  claim 9 , wherein central area is circular and has a diameter which is smaller than a diameter of the contact surface. 
   
   
       11 . The device as claimed in  claim 1 , wherein at least one outer conductor extends radially out of the outer ring-shaped strip conductor of the contacting facility. 
   
   
       12 . The device as claimed in  claim 1 , wherein the foil narrows stepwise in the direction of the contact surface. 
   
   
       13 . The device as claimed in  claim 1 , wherein the foil in the area of the window is V-shaped in cross-section and has a gradient in the range greater than 20° and less than 60°. 
   
   
       14 . The device as claimed in  claim 1 , wherein the contacting facility is connected mechanically with the foil and the contact surface. 
   
   
       15 . The device as claimed in  claim 1 , wherein at least one of the flexible contacting facility features copper, and the thickness of the flexible contacting facility is minimized having regard to the power consumption of the semiconductor chip. 
   
   
       16 . The device as claimed in  claim 1 , wherein the thickness of the foil is minimized having regard to its insulating properties. 
   
   
       17 . A method for making contact between a semiconductor chip device with one or more electrical contact surfaces, the method comprising:
 applying a foil made from electrically insulating plastic material onto the surface of a substrate of the device;   exposing each contact surface, to be contacted on the surface by opening respective windows in the foil; and   establishing planar contact between each exposed contact surface and at least one layer made from electrically conducting material.   
   
   
       18 . The method as claimed in  claim 17 , whereby the substrate is equipped with one or more semiconductor chips, on each of which one or more contact surfaces to be contacted is present, and whereby the foil is applied, to the surface such that the foil very tightly covers this surface including each semiconductor chip and each contact surface and adheres on the surface including each of the one or more semiconductor chips. 
   
   
       19 . The method as claimed in  claim 18 , whereby the substrate is equipped with one or more power semiconductor chips. 
   
   
       20 .- 21 . (canceled) 
   
   
       22 . The device as claimed in  claim 2 , wherein the area of the layer made from electrically conducting material is smaller than the contact surface. 
   
   
       23 . The device as claimed in  claim 2 , wherein at least one of at least three strip conductors running radially and at least one ring-shaped outer strip conductor is implemented. 
   
   
       24 . The device as claimed in  claim 2 , wherein the at least three strip conductors running radially have at least one angular bulge.