Electronic devices and processes for forming the same
Abstract
An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.
Claims
exact text as granted — not AI-modified1 . An electronic device comprising an array, wherein the array comprises:
a first set of first electronic components lying closest to a first side of the array; a second set of second electronic components lying closest to a second side of the array, wherein the second side is opposite the first side; and a first layer within at least some of the electronic components, wherein the first layer is in a form of a series of first segments, wherein at least one of the first segments extends continuously from one of the first electronic components to one of the second electronic components, wherein the array is substantially free of a stitching defect.
2 . The electronic device of claim 1 , further comprising:
a second layer within at least some of the electronic components, wherein the second layer is in a form of a series of second segments, wherein at least one of the second segments extends continuously from one of the first electronic components to one of the second electronic components; and a third layer within at least some of the electronic components, wherein the layer is in a form of a series of third segments, wherein at least one of the third segments extends continuously from one of the first electronic components to one of the second electronic components.
3 . The electronic device of claim 2 , wherein the first layer is a blue light-emitting layer, the second layer is a green light-emitting layer, and the third layer is a red light-emitting layer.
4 . The electronic device of claim 1 , further comprising:
a well structure having openings, longitudinal portions and transverse portions, wherein:
the longitudinal portions have lengths substantially parallel to the lengths of the first segments; and
the transverse portions have lengths substantially perpendicular to the lengths of the first segments;
a second layer lying within at least two openings and overlying at least one transverse portion lying between the at least two opening, wherein the first layer overlies the second layer; and an electrode over the first and second layers, wherein the first layer substantially prevents the electrode from contacting the second layer over the at least one transverse portion.
5 . The electronic device of claim 1 , wherein the first layer is an organic active layer.
6 . A process for forming an electronic device comprising:
printing a first segment onto a workpiece; and printing a second segment onto the first segment, wherein the first and second segments have substantially a same composition.
7 . The process of claim 6 , wherein, as seen from a plan view:
the first segment has a first length extending in a first direction; the second segment has a second length extending in a second direction; and the first and second directions are substantially a same direction.
8 . The process of claim 7 , wherein the second segment is at least as thick as the first segment.
8 . The process of claim 8 , wherein from a plan view, a width of the second segment is narrower compared to a width of the first segment.
10 . The process of claim 7 , further comprising printing a third segment onto the second segment, wherein:
the first, second, and third segments have substantially a same composition; and a width of the second segment is narrower compared to a width of the first segment; and a width of the third segment is narrower compared to the width of the second segment.
11 . The process of claim 7 , wherein:
the electronic device comprises an electronic component; the electronic component comprises an organic active layer; and the organic active layer comprises the first segment.
12 . A process for forming an electronic device comprising:
placing a workpiece onto a chuck; and printing a layer onto the workpiece and at least one exposed portion of the chuck.
13 . The process of claim 12 , wherein (1) the layer is printed onto the at least one exposed portion of the chuck before the layer is printed onto the workpiece, (2) the layer is printed onto the at least one exposed portion the chuck after the layer is printed onto the workpiece, or (3) the layer is printed onto the at least one exposed portion of the chuck before and after the layer is printed onto the workpiece.
14 . The process of claim 12 , wherein the at least one exposed portion of the chuck and an exposed surface of the workpiece are at substantially a same elevation.
15 . The process of claim 12 , wherein an elevation of the at least one exposed portion of the chuck is no more than approximately 2 mm from an elevation of an exposed surface of the workpiece.
16 . The process of claim 12 , wherein:
the electronic device comprises an electronic component; the electronic component comprises an organic active layer; and the organic active layer comprises the first layer.
17 . A process for forming an electronic device comprising:
placing a workpiece onto a chuck; and printing a layer onto a workpiece while a printing head is greater than 0.5 mm from the workpiece.
18 . The process of claim 17 , wherein the printing head is no more than 0.9 mm from the workpiece.
19 . The process of claim 17 , wherein the printing head is no more than 2.0 mm from the workpiece.
20 . The process of claim 17 , wherein:
the electronic device comprises an electronic component; the electronic component comprises an organic active layer; and the organic active layer comprises the layer.Cited by (0)
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