Semiconductor device manufacturing method and manufacturing apparatus

Abstract

A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; cutting the terminals along a boundary between the first region and the second region; and continuously cutting the reinforcing member from an inboard side thereof to an outboard side along the boundary between the first region and the second region.

1 . An apparatus for manufacturing a semiconductor device including a wiring substrate having a first region where a semiconductor chip is mounted and a second region around the first region, and terminals extending from the first region to the second region formed on one surface thereof, comprising:
 a cutting section that cuts the wiring substrate;   wherein a reinforcing member is provided on another surface of the wiring substrate, the reinforcing member overlapping the terminals and a part of the reinforcing member protrudes from the first region to the second region; and   wherein the cutting section includes:
 a first cutting section cutting the terminals along a boundary between the first region and the second region; and 
 a second cutting section continuously cutting the reinforcing member from an inboard side to an outboard side along the boundary between the first region and the second region. 
   
   
   
       2 . The apparatus for manufacturing a semiconductor device according to  claim 1 , wherein:
 the first cutting section punches through from a surface side having the terminals in the wiring substrate; and   the second cutting section punches through from the surface side having the terminals in the wiring substrate.   
   
   
       3 . The apparatus for manufacturing a semiconductor device according to  claim 2 , wherein:
 the first cutting section is disposed on an upstream side in a transfer direction of the wiring substrate with respect to the second cutting section.   
   
   
       4 . The apparatus for manufacturing a semiconductor device according to  claim 2 , wherein:
 the first cutting section includes a die for pressing the first region to be fixed, and a punch to punch through the second region.   
   
   
       5 . The apparatus for manufacturing a semiconductor device according to  claim 2 , wherein:
 the second cutting section includes a die for pressing the second region to be fixed, and a punch to punch through the first region.