Metal trace fabrication for optical element

Abstract

A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.

1 . A method comprising:
 creating an optical element including a surface defining a recess;   depositing conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess; and   substantially planarizing the surface to expose the portion of the conductive material disposed within the recess.   
     
     
         2 . A method according to  claim 1 , wherein substantially planarizing the surface comprises chemical-mechanical polishing the conductive material and the surface. 
     
     
         3 . A method according to  claim 1 , wherein creating the optical element comprises molding the optical element with a mold defining the optical element and the recess. 
     
     
         4 . A method according to  claim 1 , wherein depositing the conductive material comprises spraying molten conductive material onto the optical element. 
     
     
         5 . A method according to  claim 4 , wherein depositing the conductive material further comprises placing a stencil on the optical element prior to spraying the molten conductive material onto the optical element. 
     
     
         6 . A method according to  claim 1 , wherein the optical element comprises a transparent portion including the surface. 
     
     
         7 . A method according to  claim 1 , further comprising:
 depositing a reflective material on the optical element, the reflective material not being applied to the surface;   depositing an electrical isolator on the reflective material, the electrical isolator not being applied to the surface; and   depositing the conductive material on the electrical isolator.   
     
     
         8 . A method according to  claim 7 , wherein depositing the conductive material on the electrical isolator comprises placing a stencil on the electrical isolator prior to metal spraying the conductive material onto the electrical isolator. 
     
     
         9 . A method according to  claim 1 , further comprising;
 depositing a solder mask over the exposed portion of the conductive material,   wherein the solder mask defines an aperture through which light from the optical element may pass.   
     
     
         10 . A method according to  claim 9 , further comprising:
 coupling a terminal of a solar cell to the exposed portion of the conductive material,   wherein a portion of the solar cell is disposed over the aperture.   
     
     
         11 . An apparatus comprising:
 an optical element including a surface defining a recess;   conductive material disposed within the recess; and   a solder mask disposed over a portion of the conductive material,   wherein the solder mask defines an aperture through which light from the optical element may pass.   
     
     
         12 . An apparatus according to  claim 11 , wherein the optical element comprises a transparent portion including the surface, and light may pass from the transparent portion through the aperture. 
     
     
         13 . An apparatus according to  claim 11 , wherein the surface and an exposed surface of the conductive material are substantially coplanar. 
     
     
         14 . An apparatus according to  claim 11 , further comprising:
 a reflective material disposed on the optical element and not on the surface;   an electrical isolator disposed on the reflective material and not on the surface; and   second conductive material is disposed on the electrical isolator.   
     
     
         15 . An apparatus according to  claim 11 , further comprising:
 a solar cell comprising a terminal,   wherein the aperture exposes a portion of the conductive material,   wherein the terminal is coupled to the exposed portion of the conductive material, and   wherein a portion of the solar cell is disposed to receive the light from the aperture.   
     
     
         16 . A method comprising:
 creating an optical element including a surface defining a recess;   depositing a material on areas of the surface other than the recess;   depositing conductive material on the material and within the recess; and   removing the material and any conductive material deposited thereon.   
     
     
         17 . A method according to  claim 16 , wherein depositing the conductive material comprises spraying molten conductive material onto the optical element. 
     
     
         18 . A method according to  claim 17 , wherein depositing the conductive material further comprises placing a stencil on the optical element prior to spraying the molten conductive material onto the optical element. 
     
     
         19 . A method according to  claim 16 , further comprising:
 depositing a reflective material on the optical element, the reflective material not being applied to the surface;   depositing an electrical isolator on the reflective material, the electrical isolator not being applied to the surface; and   depositing the conductive material on the electrical isolator.   
     
     
         20 . A method comprising:
 depositing a conductive material on an optical element;   depositing photoresist on the conductive material;   removing a portion of the photoresist to expose a portion of the conductive material;   plating the exposed portion of the conductive material with a second conductive material;   removing a remaining portion of the photoresist; and   removing unplated portions of the conductive material.   
     
     
         21 . A method according to  claim 20 , wherein:
 the conductive material and the second conductive material are substantially similar, and   removing the unplated portions comprises etching the unplated portions and a portion of the second conductive material.   
     
     
         22 . A method according to  claim 20 , wherein:
 the conductive material and the second conductive material are different; and   removing the unplated portions comprises selectively etching the unplated portions without etching the second conductive material.