Substrate processing apparatus

Abstract

A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

1 . A substrate processing method comprising:
 polishing a bevel portion and an edge portion of a substrate, which has been subject to CMP process, by a polishing tape.   
   
   
       2 . A substrate processing method comprising:
 pressing a polishing tape by a polishing head against a bevel portion of a substrate rotated by a rotating mechanism to polish the bevel portion of the substrate; and   detecting a polishing end point based on measurement of irregularities of the bevel portion by applying light having a predetermined shape and intensity to a portion of the bevel portion in a normal direction of device-formed surface of the substrate and measuring scattered light from the portion of the bevel portion.   
   
   
       3 . A substrate processing method according to  claim 2 , wherein said light comprises laser or LED. 
   
   
       4 . A substrate processing apparatus comprising:
 a polishing tape;   a rotation mechanism for rotating a substrate;   a polishing head for pressing the polishing tape against a bevel portion of a substrate rotated by the rotation mechanism to polish the bevel portion of the substrate; and   an optical device for applying light having a predetermined shape and intensity to a portion of the bevel portion in a normal direction of device-formed surface of the substrate and measuring scattered light from the portion of the bevel portion to detect a polishing end point based on measurement of irregularities of the bevel portion.   
   
   
       5 . A substrate processing apparatus according to  claim 4 , wherein said light comprises laser or LED.