US2008190115A1PendingUtilityA1
Thermoelectric Cooler Module Structure
Est. expiryFeb 14, 2027(~0.6 yrs left)· nominal 20-yr term from priority
H10N 10/17F25B 21/02
33
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Claims
Abstract
The present invention provides a thermoelectric cooler module structure comprising a first conductive pad, a second conductive pad, and a third conductive pad, wherein a first thermoelectric pellet and a second thermoelectric pellet are formed on said first conductive pad separately to connect said first conductive pad and said second conductive pad, said first conductive pad and said third conductive pad, and an isolation layer formed between said first thermoelectric pellet and said second thermoelectric pellet on said first conductive pad.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A thermoelectric cooler module structure comprising a first conductive pad, a second conductive pad, and a third conductive pad, wherein a first thermoelectric pellet and a second thermoelectric pellet are formed on said first conductive pad separately to connect said first conductive pad and said second conductive pad, and said first conductive pad and said third conductive pad; characterized by:
an isolation layer formed between said first thermoelectric pellet and said second thermoelectric pellet on said first conductive pad.
2 . The thermoelectric cooler structure according to the claim 1 , wherein said first conductive pad comprises a first conductive pad.
3 . The thermoelectric cooler structure according to the claim 1 , wherein said second conductive pad comprises a second conductive pad.
4 . The thermoelectric cooler structure according to the claim 1 , wherein said third conductive pad comprises a third conductive pad.Join the waitlist — get patent alerts
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