Heat-dissipating module

Abstract

A heat-dissipating module including a board-type heat-pipe and a heat-conductive construction connected therewith. The heat-conductive construction has a connecting end in contact with the board-type heat-pipe. Via the connecting end, the heat-conductive construction is connected to a predetermined section of the board-type heat-pipe. The other section of the heat-conductive construction forms an open end. The board-type heat-pipe is composed of multiple independent heat-pipe units not communicating with each other. The heat generated by a heat-generating element can be quickly and uniformly transferred through the heat-pipe units to the heat-conductive construction for dissipating the heat at high efficiency.

1 . A heat-dissipating module comprising a board-type heat-pipe and a heat-conductive construction connected therewith, the heat-conductive construction having a connecting end in contact with the board-type heat-pipe, via the connecting end, the heat-conductive construction being disposed on a predetermined section of the board-type heat-pipe, the other section of the heat-conductive construction forming an open end, the board-type heat-pipe being composed of multiple independent heat-pipe units not communicating with each other. 
   
   
       2 . The heat-dissipating module as claimed in  claim 1 , wherein the multiple heat-pipe units are arranged side by side. 
   
   
       3 . The heat-dissipating module as claimed in  claim 1 , wherein phase-changeable material is contained in the heat-pipe units. 
   
   
       4 . The heat-dissipating module as claimed in  claim 2 , wherein phase-changeable material is contained in the heat-pipe units. 
   
   
       5 . The heat-dissipating module as claimed in  claim 3 , wherein the phase-changeable material is pure water, coolant, organic solvent or a composition thereof. 
   
   
       6 . The heat-dissipating module as claimed in  claim 4 , wherein the phase-changeable material is pure water, coolant, organic solvent or a composition thereof. 
   
   
       7 . The heat-dissipating module as claimed in  claim 1 , wherein the heat-conductive construction includes multiple heat-conductive plates arranged around the board-type heat-pipe. 
   
   
       8 . The heat-dissipating module as claimed in  claim 2 , wherein the heat-conductive construction includes multiple heat-conductive plates arranged around the board-type heat-pipe. 
   
   
       9 . The heat-dissipating module as claimed in  claim 3 , wherein the heat-conductive construction includes multiple heat-conductive plates arranged around the board-type heat-pipe. 
   
   
       10 . The heat-dissipating module as claimed in  claim 5 , wherein the heat-conductive construction includes multiple heat-conductive plates arranged around the board-type heat-pipe. 
   
   
       11 . The heat-dissipating module as claimed in  claim 1 , wherein the heat-conductive construction is a metal block formed with multiple channels. 
   
   
       12 . The heat-dissipating module as claimed in  claim 2 , wherein the heat-conductive construction is a metal block formed with multiple channels. 
   
   
       13 . The heat-dissipating module as claimed in  claim 3 , wherein the heat-conductive construction is a metal block formed with multiple channels. 
   
   
       14 . The heat-dissipating module as claimed in  claim 5 , wherein the heat-conductive construction is a metal block formed with multiple channels. 
   
   
       15 . The heat-dissipating module as claimed in  claim 7 , wherein the heat-conductive construction is a metal block formed with multiple channels. 
   
   
       16 . The heat-dissipating module as claimed in  claim 9 , wherein the heat-conductive construction is a metal block formed with multiple channels. 
   
   
       17 . The heat-dissipating module as claimed in  claim 10 , wherein the heat-conductive construction is a metal block formed with multiple channels. 
   
   
       18 . The heat-dissipating module as claimed in  claim 1 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       19 . The heat-dissipating module as claimed in  claim 2 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       20 . The heat-dissipating module as claimed in  claim 3 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       21 . The heat-dissipating module as claimed in  claim 5 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       22 . The heat-dissipating module as claimed in  claim 7 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       23 . The heat-dissipating module as claimed in  claim 9 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       24 . The heat-dissipating module as claimed in  claim 10 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       25 . The heat-dissipating module as claimed in  claim 11 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       26 . The heat-dissipating module as claimed in  claim 13 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       27 . The heat-dissipating module as claimed in  claim 14 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       28 . The heat-dissipating module as claimed in  claim 15 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       29 . The heat-dissipating module as claimed in  claim 16 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly. 
   
   
       30 . The heat-dissipating module as claimed in  claim 17 , wherein the surface of one end of the board-type heat-pipe partially contacts a heat-generating element directly or indirectly.