Passive electronic device

Abstract

A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

1 . An interposer comprising:
 a first planar face and a second planar face;   an array of upper connections on said first planar face and opposing lower connections on said second planar face with conduction paths between each upper connection of said upper connections and a lower connection of said lower connections;   at least one capacitor comprising:
 a plurality of parallel plates with a dielectric there between; 
 at least one first external termination in electrical contact with a first set of alternate parallel plates; and 
 at least one second external termination in electrical contact with a second set of alternate parallel plates; 
   said capacitor is electrically or physically connected to said first planar face with said first external termination in direct electrical contact with a first upper connection and said second external termination is in direct electrical contact with a second upper connection; and   at least one upper connection, said first external termination and said second external termination arranged for direct electrical contact with element contact pads of a common element.   
     
     
         2 . The interposer of  claim 1  wherein said common element is selected from an integrated circuit and a printed circuit board. 
     
     
         3 . The interposer of  claim 2  further comprising one of an integrated circuit, an integrated circuit package and a printed circuit board in direct electrical contact with said lower pads. 
     
     
         4 . The interposer of  claim 1  wherein at least one said upper connection comprises at least one of a pin, a socket, a land grid, a wire bond, a solder pad or a solder ball. 
     
     
         5 . The interposer of  claim 1  wherein at least one said lower connection comprises at least one of a pin, a socket, a land grid, a wire bond, a solder pad or a solder ball. 
     
     
         6 . The interposer of  claim 1  wherein at least one conduction path of said conduction paths is a functional conduction path. 
     
     
         7 . The interposer of  claim 6  wherein said functional conduction path comprises at least one of a signal carrier, a resistor, an inductor and a varistor. 
     
     
         8 . The interposer of  claim 7  wherein said resistor has a resistance of at least 10 −6  ohm to no more than 10 10  ohm. 
     
     
         9 . An electronic package comprising the interposer of  claim 7 . 
     
     
         10 . An electronic device comprising the interposer of  claim 7 . 
     
     
         11 . The interposer of  claim 1  wherein said array of upper connections comprises rows and columns. 
     
     
         12 . The interposer of  claim 11  further comprising multiple capacitors wherein each capacitor of said multiple capacitors is offset by at least one row and at least one column of said array of upper connections. 
     
     
         13 . The interposer of  claim 1  wherein said parallel plates are perpendicular to said first planar face. 
     
     
         14 . An electronic package comprising:
 an integrated circuit comprising an array of IC contacts;   a printed circuit board comprising an array of PCB contacts; and   an interposer between said integrated circuit and said printed circuit board comprising:   a first planar face and a second planar face;   an array of upper connections on said first planar face and opposing lower connections on said second planar face with conduction paths between each upper connection of said upper connections and a lower connection of said lower connections;   at least one capacitor comprising:
 a plurality of parallel plates with a dielectric there between; 
 at least one first external termination in electrical contact with a first set of alternate parallel plates; and 
 at least one second external termination in electrical contact with a second set of alternate parallel plates; 
   said capacitor is mounted on said first planar face with said first external termination in direct electrical contact with a first upper connection and said second external termination is in direct electrical contact with a second upper connection;   at least one upper connection, said first external termination and said second external termination are in direct electrical contact with one of said array of IC contacts and said array of PCB contacts; and   said lower connections are in electrical contact with one of said array of IC contacts and said array of PCB contacts different from said upper connections.   
     
     
         15 . The electronic package of  claim 14  wherein at least one said upper connection comprises at least one of a pin a land grid, a wire bond, a socket, a solder pad or a solder ball. 
     
     
         16 . The electronic package of  claim 14  wherein at least one said lower connection comprises at least one of a pin, a land grid, a wire bond, a socket, a solder pad or a solder ball. 
     
     
         17 . The electronic package of  claim 14  wherein at least one conduction path of said conduction paths is a functional conduction path. 
     
     
         18 . The electronic package of  claim 17  wherein said functional conduction path comprises at least one of a signal carrier, a resistor, an inductor and a varistor. 
     
     
         19 . The electronic package of  claim 17  wherein said resistor has a resistance of at least 10 −6  ohm to no more than 10 10  ohm. 
     
     
         20 . An electronic device comprising the electronic package of  claim 18 . 
     
     
         21 . The electronic package of  claim 14  wherein said array of upper connections comprises row and columns. 
     
     
         22 . The electronic package of  claim 21  further comprising multiple capacitors wherein each capacitor of said multiple capacitors is offset by at least one row and at least one column of said array of upper connections. 
     
     
         23 . The electronic package of  claim 14  wherein said parallel plates are perpendicular to said planar face. 
     
     
         24 . An electronic device comprising:
 an electronic package comprising:
 an integrated circuit comprising an array of IC contacts; 
 a printed circuit board comprising an array of PCB contacts; and 
 an interposer between said integrated circuit and said printed circuit board comprising: 
 a first planar face and a second planar face; 
 an array of upper connections on said first planar face and opposing lower connections on said second planar face with conduction paths between each upper connection of said upper connections and a lower connection of said lower connections; 
 at least one capacitor comprising:
 a plurality of parallel plates with a dielectric there between; 
 at least one first external termination in electrical contact with a first set of alternate parallel plates; and 
 at least one second external termination in electrical contact with a second set of alternate parallel plates; 
 
 said capacitor is mounted on said first planar face with said first external termination in direct electrical contact with a first upper connection and said second external termination is in direct electrical contact with a second upper connection; 
 at least one upper connection, said first external termination and said second external termination are in direct electrical contact with one of said array of IC contacts and said array of PCB contacts; and 
 said lower contact pads are in electrical contact with one of said array of IC contacts and said array of PCB contacts different from said upper connections; 
   a power supply for providing power to said electronic package;   an input device capable of interfacing to provide an input signal to said electronic package; and   an output device capable of sending an output signal from said electronic package.   
     
     
         25 . The electronic device of  claim 24  wherein at least one said upper connection comprises at least one of a pin, a land grid, a wire bond, a socket, a solder pad or a solder ball. 
     
     
         26 . The electronic device of  claim 24  wherein at least one said lower connection comprises at least one of a pin, a land grid, a wire bond, a socket, a solder pad or a solder ball. 
     
     
         27 . The electronic device of  claim 24  wherein at least one conduction path of said conduction paths is a functional conduction path. 
     
     
         28 . The electronic device of  claim 27  wherein said functional conduction path comprises at least one of a signal carrier, a resistor, an inductor and a varistor. 
     
     
         29 . The electronic device of  claim 28  wherein said resistor has a resistance of at least 10 −6  ohm to no more than 10 10  ohm. 
     
     
         30 . The electronic device of  claim 24  wherein said array of upper connections comprises row and columns. 
     
     
         31 . The electronic device of  claim 30  further comprising multiple capacitors wherein each capacitor of said multiple capacitors is offset by at least one row and at least one column of said array of upper connections. 
     
     
         32 . The electronic device of  claim 24  wherein said parallel plates are perpendicular to said first planar face. 
     
     
         33 . An interposer comprising:
 a first planar face and a second planar face;   an array of upper connections on said first planar face and opposing lower connections on said second planar face with conduction paths between each upper connection of said upper connections and a lower connection of said lower connections;   at least one capacitor comprising:
 a plurality of parallel plates with a dielectric there between; 
 at least one first external termination in electrical contact with a first set of alternate parallel plates; and 
 at least one second external termination in electrical contact with a second set of alternate parallel plates; 
   said capacitor is electrically or physically connected to said first planar face with said first external termination in direct electrical contact with a first upper connection and said second external termination is in direct electrical contact with a second upper connection wherein said parallel plates are perpendicular to said first planar face; and   at least one upper connection, said first external termination and said second external termination arranged for direct electrical contact with element contact pads of a common element.   
     
     
         34 . The interposer of  claim 33  wherein said common element is selected from an integrated circuit and a printed circuit board. 
     
     
         35 . The interposer of  claim 34  further comprising one of an integrated circuit, an integrated circuit package and a printed circuit board in direct electrical contact with said lower pads. 
     
     
         36 . The interposer of  claim 33  wherein at least one said upper connection comprises at least one of a pin, a socket, a land grid, a wire bond, a solder pad or a solder ball. 
     
     
         37 . The interposer of  claim 33  wherein at least one said lower connection comprises at least one of a pin, a socket, a land grid, a wire bond, a solder pad or a solder ball. 
     
     
         38 . The interposer of  claim 33  wherein at least on one conduction path of said conduction paths is a functional conduction path. 
     
     
         39 . The interposer of  claim 38  wherein said functional conduction path comprises at least one of a signal carrier, a resistor, an inductor and a varistor. 
     
     
         40 . The interposer of  claim 39  wherein said resistor has a resistance of at least 10 −6  ohm to no more than 10 10  ohm. 
     
     
         41 . An electronic package comprising the interposer of  claim 39 . 
     
     
         42 . An electronic device comprising the interposer of  claim 39 . 
     
     
         43 . The interposer of  claim 33  wherein said array of upper connections comprises rows and columns. 
     
     
         44 . The interposer of  claim 43  further comprising multiple capacitors wherein each capacitor of said multiple capacitors is offset by at least one row and at least one column of said array of upper connections.