Electronic package structure and method

Abstract

An electronic package structure and method use a conductive strip to bond die-to-die, die-to-lead, chip carrier-to-lead, or lead-to-lead. A conductive strip may carry greater current than a bonding wire, and thus may replace several bonding wires. The bonding of the conductive strip may be carried out by an SMT process, and thus requires lower cost than wire bonding processes. A conductive strip may be bonded to more than two dice or leads to save more bonding wires. A conductive strip is stronger than a bonding wire, and thus lowers the possibility of being broken.

1 . An electronic package structure comprising:
 a first die having a first bonding pad thereon;   a second die having a second bonding pad thereon; and   a conductive strip bonded to the first bonding pad and the second bonding pad.   
     
     
         2 . The electronic package structure of  claim 1 , further comprising a chip carrier carrying the first die and the second die. 
     
     
         3 . The electronic package structure of  claim 2 , wherein the chip carrier comprises:
 a first portion having the first die thereon; and   a second portion having the second die thereon;   wherein the first portion and the second portion are electrically connected to each other.   
     
     
         4 . The electronic package structure of  claim 2 , wherein the chip carrier comprises:
 a first portion having the first die thereon; and   a second portion having the second die thereon;   wherein the first portion and the second portion are electrically insulated from each other.   
     
     
         5 . The electronic package structure of  claim 1 , further comprising:
 a third die having a third bonding pad thereon; and   a bonding wire bonded to the third bonding pad and a fourth bonding pad on the first die.   
     
     
         6 . The electronic package structure of  claim 5 , further comprising a chip carrier carrying the first die, the second die and the third die. 
     
     
         7 . The electronic package structure of  claim 6 , wherein the chip carrier comprises:
 a first portion having the first die thereon;   a second portion having the second die thereon; and   a third portion having the third die thereon;   wherein at least two of the first portion, the second portion and the third portion are electrically connected to each other.   
     
     
         8 . The electronic package structure of  claim 6 , wherein the chip carrier comprises:
 a first portion having the first die thereon;   a second portion having the second die thereon; and   a third portion having the third die thereon;   wherein at least two of the first portion, the second portion and the third portion are electrically insulated from each other.   
     
     
         9 . The electronic package structure of  claim 1 , wherein at least one of the first bonding pad and the second bonding pad has a bump thereon, and the conductive strip is bonded thereon. 
     
     
         10 . The electronic package structure of  claim 1 , wherein the conductive strip is a metal. 
     
     
         11 . An electronic package structure comprising:
 a die having a bonding pad thereon;   a lead of a leadframe; and   a conductive strip bonded to the bonding pad and the lead.   
     
     
         12 . The electronic package structure of  claim 11 , further comprising a chip carrier of the leadframe carrying the die. 
     
     
         13 . The electronic package structure of  claim 11 , wherein the bonding pad has a bump thereon, and the conductive strip is bonded thereon. 
     
     
         14 . The electronic package structure of  claim 11 , wherein the lead has a bonding material thereon, and the conductive strip is bonded thereon. 
     
     
         15 . The electronic package structure of  claim 14 , wherein the bonding material is a solder. 
     
     
         16 . The electronic package structure of  claim 14 , wherein the bonding material is a conductive glue. 
     
     
         17 . The electronic package structure of  claim 11 , wherein the conductive strip is a metal. 
     
     
         18 . An electronic package structure comprising:
 a die having a bonding pad thereon;   a chip carrier of a leadframe carrying the die;   a lead of the leadframe; and   a conductive strip bonded to the lead and the chip carrier.   
     
     
         19 . The electronic package structure of  claim 18 , wherein each of the lead and the chip carrier has a bonding material thereon, and the conductive strip is bonded thereon. 
     
     
         20 . The electronic package structure of  claim 19 , wherein the bonding material is a solder. 
     
     
         21 . The electronic package structure of  claim 19 , wherein the bonding material is a conductive glue. 
     
     
         22 . The electronic package structure of  claim 18 , further comprising a bonding wire bonded to the chip carrier and the lead. 
     
     
         23 . The electronic package structure of  claim 18 , further comprising:
 a second lead of the leadframe; and   a bonding wire bonded to the second lead and the bonding pad.   
     
     
         24 . The electronic package structure of  claim 18 , wherein the conductive strip is a metal. 
     
     
         25 . An electronic package structure comprising:
 a die having a bonding pad thereon;   a chip carrier of a leadframe carrying the die;   a first lead of the leadframe;   a second lead of the leadframe; and   a conductive strip bonded to the first lead and the second lead.   
     
     
         26 . The electronic package structure of  claim 25 , wherein each of the first lead and the second lead has a bonding material thereon, and the conductive strip is bonded thereon. 
     
     
         27 . The electronic package structure of  claim 26 , wherein the bonding material is a solder. 
     
     
         28 . The electronic package structure of  claim 26 , wherein the bonding material is a conductive glue. 
     
     
         29 . The electronic package structure of  claim 25 , further comprising a bonding wire bonded to the bonding pad and the first lead. 
     
     
         30 . An electronic package method comprising the steps of:
 providing two dice, each having a bonding pad thereon; and   bonding a conductive strip to the two bonding pads.   
     
     
         31 . The electronic package method of  claim 30 , further comprising the step of attaching the two dice on a chip carrier. 
     
     
         32 . The electronic package method of  claim 30 , wherein the step of bonding a conductive strip to the two bonding pads comprises the steps of:
 applying a bonding material on the conductive strip or on the two bonding pads;   disposing the conductive strip on the two bonding pads with the bonding material therebetween; and   heat treatment for bonding the conductive strip to the two bonding pads with the bonding material.   
     
     
         33 . The electronic package method of  claim 32 , wherein at least one of the two bonding pads has a bump thereon, and the conductive strip is bonded thereto. 
     
     
         34 . The electronic package method of  claim 30 , further comprising the step of bonding a wire to a third bonding pad on the first die and a fourth bonding pad on a third die. 
     
     
         35 . An electronic package method comprising the steps of:
 providing a die having a bonding pad thereon and a lead of a leadframe; and   bonding a conductive strip to the bonding pad and the lead.   
     
     
         36 . The electronic package method of  claim 35 , further comprising the step of attaching the die on a chip carrier of the leadframe. 
     
     
         37 . The electronic package method of  claim 35 , wherein the step of bonding a conductive strip to the bonding pad and the lead comprises the steps of:
 applying a bonding material on the conductive strip, or on the bonding pad and the lead;   disposing the conductive strip on the bonding pad and the lead with the bonding material therebetween; and   heat treatment for bonding the conductive strip to the bonding pad and the lead with the bonding material.   
     
     
         38 . The electronic package method of  claim 37 , wherein the bonding pad has a bump thereon, and the conductive strip is bonded thereon. 
     
     
         39 . The electronic package method of  claim 35 , wherein the step of applying a bonding material on the conductive strip, or on the bonding pad and the lead comprises the step of printing or spotting the bonding material on the conductive strip, or on the bonding pad and the lead. 
     
     
         40 . An electronic package method comprising the steps of:
 providing a chip carrier and a lead of a leadframe; and   bonding a conductive strip to the chip carrier and the lead.   
     
     
         41 . The electronic package method of  claim 40 , wherein the step of bonding a conductive strip to the chip carrier and the lead comprises the steps of:
 applying a bonding material on the conductive strip, or on the chip carrier and the lead;   disposing the conductive strip on the chip carrier and the lead with the bonding material therebetween; and   heat treatment for bonding the conductive strip to the chip carrier and the lead.   
     
     
         42 . The electronic package method of  claim 40 , further comprising the step of bonding a wire to the chip carrier and a bonding pad on a die. 
     
     
         43 . The electronic package method of  claim 40 , further comprising the step of bonding a wire to a bonding: pad of a die on the chip carrier and a second lead. 
     
     
         44 . An electronic package method comprising the steps of:
 providing two leads of a leadframe; and   bonding a conductive strip to the two leads.   
     
     
         45 . The electronic package method of  claim 44 , wherein the step of bonding a conductive strip to the two leads comprises the steps of:
 applying a bonding material on the conductive strip or on the two leads;   disposing the conductive strip on the two leads with the bonding material therebetween; and   heat treatment for bonding the conductive strip to the two leads.   
     
     
         46 . The electronic package method of  claim 44 , further comprising the step of bonding a wire to the first lead and a bonding pad on a die.