Catalytic treatment method, electroless plating method, and method for forming circuit using electroless plating

Abstract

A catalyst layer which enables an electroless plating method to be carried out can be formed by an inexpensive and simple process without using palladium. There are provided a tin treatment step of bringing a substrate into contact with a tin compound aqueous solution containing a tin compound; after the tin treatment step, a copper treatment step of bringing a substrate 1 into contact with a copper compound aqueous solution containing a copper compound; after the copper treatment step, a diluted sulfuric acid treatment step of bringing the substrate 1 into contact with diluted sulfuric acid; after the diluted sulfuric acid treatment step, a plating treatment step of bringing the substrate 1 into contact with a plating solution to form a copper plating film 2 ; and after the plating treatment step, a heat treatment step of heating the substrate 1 in an atmosphere substantially containing no oxygen and hydrogen.

1 . A catalytic treatment method comprising:
 a tin treatment step of bringing a substrate into contact with a tin compound aqueous solution containing a tin compound;   after the tin treatment step, a copper treatment step of bringing the substrate into contact with a copper compound aqueous solution containing a copper compound; and   after the copper treatment step, a diluted sulfuric acid treatment step of bringing the substrate into contact with diluted sulfuric acid.   
     
     
         2 . The catalytic treatment method according to  claim 1 , wherein the copper compound aqueous solution has sulfuric acid acidity. 
     
     
         3 . A catalytic treatment method comprising:
 a tin treatment step of bringing a substrate into contact with a tin compound aqueous solution containing a tin compound; and   after the tin treatment step, a copper treatment step of bringing the substrate into contact with a copper compound aqueous solution which contains a sulfuric acid-acidic copper compound.   
     
     
         4 . The catalytic treatment method according to one of  claims 1  to  3 , wherein the tin treatment step and the copper treatment step are sequentially repeated a plurality of times. 
     
     
         5 . An electroless plating method comprising:
 a tin treatment step of bringing a substrate into contact with a tin compound aqueous solution containing a tin compound;   after the tin treatment step, a copper treatment step of bringing the substrate into contact with a copper compound aqueous solution containing a copper compound;   after the copper treatment step, a diluted sulfuric acid treatment step of bringing the substrate into contact with diluted sulfuric acid; and   after the diluted sulfuric acid treatment, a plating treatment step of bringing the substrate into contact with a plating solution to form a plating film.   
     
     
         6 . The electroless plating method according to  claim 5 , wherein the copper compound aqueous solution has sulfuric acid acidity. 
     
     
         7 . An electroless plating method comprising:
 a tin treatment step of bringing a substrate into contact with a tin compound aqueous solution containing a tin compound;   after the tin treatment step, a copper treatment step of bringing the substrate into contact with a copper compound aqueous solution which contains a sulfuric acid-acidic copper compound; and   after the copper treatment step, a plating treatment step of bringing the substrate into contact with a plating solution to form a plating film.   
     
     
         8 . The electroless plating method according to one of  claims 5  to  7 , further comprising, after the plating treatment step, a heat treatment step of heating the substrate in an atmosphere substantially containing no oxygen and hydrogen. 
     
     
         9 . A method for forming a circuit using an electroless plating method, comprising:
 a tin treatment step of bringing a substrate into contact with a tin compound aqueous solution containing a tin compound;   after the tin treatment step, a copper treatment step of bringing the substrate into contact with a copper compound aqueous solution containing a copper compound;   an oxidation treatment step of irradiating ultraviolet rays to an arbitrary portion of metal copper formed on the substrate by deposition so as to oxidize an exposed portion of the metal copper;   a diluted sulfuric acid treatment step of bringing the substrate into contact with diluted sulfuric acid to remove oxide copper so as to form the metal copper into an arbitrary pattern; and   a plating treatment step of bringing the substrate into contact with a plating solution to form a plating film using the metal copper as nuclei.   
     
     
         10 . The method for forming a circuit using an electroless plating method, according to  claim 9 , wherein the wavelength of the ultraviolet rays used in the oxidation treatment step is 254 nm or less. 
     
     
         11 . The method for forming a circuit using an electroless plating method, according to  claim 9  or  10 , further comprising, after the diluted sulfuric acid treatment step and before the plating treatment step, a palladium treatment step of bringing the substrate into contact with a palladium solution containing palladium.