US2008201937A1PendingUtilityA1

Methods for Making Data Storage Media and the Resultant Media

59
Assignee: GEN ELECTRICPriority: Feb 12, 1999Filed: Oct 17, 2007Published: Aug 28, 2008
Est. expiryFeb 12, 2019(expired)· nominal 20-yr term from priority
B29C 43/021Y10T428/24967G11B 5/84Y10T428/265Y10T428/266G11B 7/24038G11B 7/2532Y10T428/3154G11B 7/24047G11B 2007/25713G11B 7/253G11B 7/24056G11B 7/2542B29D 17/005G11B 7/259G11B 7/263Y10T428/24479G11B 11/10582Y10T156/1002Y10T29/49069B29C 2043/025G11B 5/855Y10T29/4903G11C 13/02Y10T428/31G11B 7/258Y10T29/4902B29L 2017/005G11B 7/2536Y10T29/49043B82Y 10/00G11B 7/2533G11B 5/8404Y10T29/49158G11B 11/10584B82Y 30/00G11B 7/2578Y10T29/49002G11B 7/26Y10T428/24355Y10T29/49172Y10T29/49176G11B 11/10586G11B 7/2531G11B 7/2548G11B 7/2534G11C 13/025G11B 2007/25708G11B 5/72G11B 7/266G11B 2007/25302G11B 2007/25301G11B 7/261G11B 5/73919G11B 5/73921G11B 5/73913
59
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Methods for forming data storage media and the media formed thereby are disclosed herein. In one embodiment, the method for forming a data storage media, comprises: injection molding a substrate comprising surface features, wherein said surface features have greater than about 90% of a surface feature replication of an original master; and disposing a data layer over at least one surface of said substrate; wherein said data storage media has an axial displacement peak of less than about 500μ under shock or vibration excitation when excited by a 1 G sinusoidal loading.

Claims

exact text as granted — not AI-modified
1 . A method for forming a data storage media, comprising:
 injection molding a substrate comprising a plastic surface and a preformed core, wherein the plastic surface comprises surface features, wherein said surface features have greater than about 90% of a surface feature replication of an original master; and   disposing a data layer over at least one surface of said substrate;   wherein said data storage media has an axial displacement peak of less than about 500μ under shock or vibration excitation when excited by a 1 G sinusoidal loading;   wherein the storage medium has a thickness of up to about 1.2 mm.   
     
     
         2 . The method of  claim 1 , wherein said core comprises a material selected from the group consisting of metal, glass, ceramic, metal-matrix composite, and alloys and combinations comprising at least one of the foregoing materials. 
     
     
         3 . The method of  claim 2 , wherein said material comprises aluminum. 
     
     
         4 . The method of  claim 1 , wherein said core further comprises a varied thickness. 
     
     
         5 . The method of  claim 1 , wherein said core further comprises a cross-sectional geometry selected from the group consisting of concave, convex, tapered, and combinations comprising at least one of the foregoing core geometries. 
     
     
         6 . The method of  claim 1 , wherein said core further comprises a core outer diameter substantially equal to a substrate outer diameter. 
     
     
         7 . The method of  claim 1 , wherein said core further comprises a geometry selected from the group consisting of a radial arm, a ring, star-like, and combinations comprising at least one of the foregoing geometries. 
     
     
         8 . The method of  claim 1 , wherein said core further comprises at least one hollow cavity. 
     
     
         9 . The method of  claim 1 , wherein said core further comprises at least one filled cavity. 
     
     
         10 . The method of  claim 9 , wherein said filled cavity comprises a material selected from the group consisting of glass, foams, carbon, metals, ceramics, thermoplastics, thermosets, rubbers, others and composites, alloys, and combinations comprising at least one of the foregoing materials. 
     
     
         11 . The method of  claim 1 , further comprising reinforcing said substrate with a material selected from the group consisting of glass, foams, carbon, metals, ceramics, thermoplastics, thermosets, rubbers, and composites, alloys, and combinations comprising at least one of the foregoing materials. 
     
     
         12 . The method of  claim 1 , wherein said data layer has a coercivity of greater than about 1,500 oersted. 
     
     
         13 . The method of  claim 12 , wherein said coercivity is greater than about 3,000 oersted. 
     
     
         14 . The method of  claim 1 , wherein the plastic surface comprises a thermoplastic. 
     
     
         15 . The method of  claim 1 , wherein the plastic surface comprises a thermoset. 
     
     
         16 . The method of  claim 1 , wherein the thickness is about 0.8 mm to about 1.2 mm. 
     
     
         17 . The method of  claim 1 , wherein the plastic surface is disposed around the preformed core. 
     
     
         18 . A method for forming a data storage medium, comprising:
 injection molding a substrate comprising a plastic surface and a preformed core, wherein the plastic surface comprises surface features, wherein said surface features have greater than about 90% of a surface feature replication of an original master;   disposing a data layer over at least one surface of said substrate; and   disposing a thermoset coating on the substrate, wherein the data layer is located between the thermoset coating and the substrate;   wherein said data storage medium has an axial displacement peak of less than about 500μ under shock or vibration excitation when excited by a 1 G sinusoidal loading; and   wherein the storage medium has a thickness of up to about 1.2 mm.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.