Light Source With Glass Housing

Abstract

A light source comprising at least one light-emitting diode ( 2 ), which emits light, and a housing ( 5 ) arranged to receive at least a portion of said light is provided. The housing ( 5 ) comprises a translucent glass material and is provided with at least one recess ( 4 ) that comprises positioning and orientating means. The at least one light-emitting diode ( 2 ) is arranged in said at least one recess ( 4 ), is positioned and orientated by said positioning and orientating means and is bonded to said housing. By utilizing a fully inorganic approach for the housing, the temperature stability of the light source is improved.

1 . A light source comprising at least one light-emitting diode which, in operation, emits light, and a housing arranged to receive at least a portion of said light, characterized in that,
 said housing comprises a translucent glass material and is provided with at least one recess that comprises positioning and orientating means,   said at least one light-emitting diode is arranged in said at least one recess, is positioned and orientated by said positioning and orientating means and is bonded to said housing.   
   
   
       2 . A light source according to  claim 1 , wherein the walls of said at least one recess constitutes said positioning and orientating means. 
   
   
       3 . A light source according to  claim 1 , wherein said housing comprises a luminescent material. 
   
   
       4 . A light source according to  claim 1 , wherein a bonding material is arranged in said at least one recess between said at least one light-emitting diode to bond said at least one light-emitting diode to said housing and said bonding material is a glass material. 
   
   
       5 . A light source according to  claim 4 , wherein said bonding material comprises a luminescent material. 
   
   
       6 . A light source according to  claim 1 , wherein a first light-emitting diode is arranged in a first recess and a second light-emitting diode is arranged in a second recess. 
   
   
       7 . A light source according to  claim 6 , wherein a first bonding material comprising a first luminescent material is arranged in said first recess, between said first light-emitting diode and said housing, and a second bonding material comprising a second luminescent material is arranged in said second recess, between said second light-emitting diode and said housing. 
   
   
       8 . A light source according to  claim 1 , wherein an optical element is bonded to said housing and arranged to receive at least a portion of said light. 
   
   
       9 . A light source according to  claim 1 , further comprising a substrate on which a circuitry is arranged, and wherein said at least one light-emitting diode is arranged on and connected to said circuitry. 
   
   
       10 . A method for the manufacture of a light source, comprising:
 providing at least one light-emitting diode;   providing a housing having at least one recess and diode positioning and orientating means arranged in said recess, said housing comprising a translucent glass material;   arranging said at least one light-emitting diode in said recess, such that said light-emitting diode is positioned and orientated by said positioning and orientating means, said at least one light-emitting diode is bonded to said housing, and said housing receives, in operation, at least a portion of light emitted by said at least one light-emitting diode.   
   
   
       11 . A method according to  claim 10 , wherein said light-emitting diode is bonded to said housing at a temperature between the glass temperature and the softening temperature of said translucent glass material. 
   
   
       12 . A method according to  claim 11 , wherein said temperature between the glass temperature and the softening temperature of said translucent glass material comprised in said housing is from 200 to 400° C. 
   
   
       13 . A method according to  claim 10 , comprising arranging a contact glass material in said at least one recess, and at a temperature between the glass temperature and the softening temperature of said contact glass material, arranging said at least one light-emitting diode on said contact glass material. 
   
   
       14 . A method according to  claim 13 , wherein said temperature between the glass temperature and the softening temperature of said contact glass material is from 200 to 400° C. 
   
   
       15 . A method according to  claim 10 , further comprising connecting said at least one light-emitting diode being bonded to said housing, to a circuitry.