Luminescent sheet covering for LEDs

Abstract

A lighting apparatus comprising at least one light emitting diode is disposed on an interconnect board to emit ultraviolet or blue radiation. A polymeric layer including a luminophor is disposed about the lighting apparatus to convert at least a portion of the radiation emitted from the LED into visible light. The polymeric layer is shrinkable to conform to a shape enclosing the light emitting diode.

1 . (canceled) 
   
   
       2 . (canceled) 
   
   
       3 . The method of  claim 22 , wherein the phosphor is one of:
 an inorganic luminescent powder;   an organic luminophor which substantially dissolves in the polymer; and   a nano-particle material.   
   
   
       4 . (canceled) 
   
   
       5 . The method of  claim 22 , wherein a thickness of the polymeric sheet is equal to from about 40 μm to about 400 μm. 
   
   
       6 . The method of  claim 22 , wherein the polymeric material comprising at least one of:
 polyvinyl chloride,   polyethylene, and   polypropylene.   
   
   
       7 . (canceled) 
   
   
       8 . The method of  claim 22 , wherein the polymeric layer is tightly shrink-wrapped over the light emitting to completely cover the light emitting diode and portions of the mounting surface adjacent the light emitting diode. 
   
   
       9 . The method of  claim 22 , wherein the polymeric sheet comprises at least a phosphor which is substantially uniformly distributed over the light emitting diode surface and portions of the interconnect board adjacent the light emitting diode. 
   
   
       10 . (canceled) 
   
   
       11 . (canceled) 
   
   
       12 . The method of  claim 22 , wherein the mounting surface is transparent at least adjacent of the light emitting diode. 
   
   
       13 . The method of  claim 12 , wherein the polymeric layer is shrink-wrapped around the light escaping surface of the board. 
   
   
       14 . The method of  claim 22 , wherein the mounting surface has a high index of refraction and makes optical contact with the light emitting diode chip and the polymeric layer. 
   
   
       15 . The method of  claim 22 , further including:
 a heatsink disposed on a side of the mounting surface opposed to the light emitting diode to dissipate heat generated by the light emitting diode.   
   
   
       16 . The method of  claim 15 , wherein the heatsink includes a plurality of wings. 
   
   
       17 . (canceled) 
   
   
       18 . (canceled) 
   
   
       19 . (canceled) 
   
   
       20 . (canceled) 
   
   
       21 . (canceled) 
   
   
       22 . A method of manufacturing a lighting apparatus, comprising:
 liquefying a polymeric material;   stirring phosphor powder into the liquefied polymeric material until the phosphor powder is one of suspended, dipersed or substantially dissolved;   forming a polymeric sheet from the phosphor including polymeric liquid;   positioning at least one light emitting diode on a mounting surface; and   shrink-wrapping the phosphor including polymeric sheet around objects to surround light emitted by the light emitting diode.