US2008207078A1PendingUtilityA1
Multi-wavelength LED construction & manufacturing proces
Assignee: TAIWAN OASIS TECHNOLOGY CO LTDPriority: Aug 4, 2005Filed: Feb 20, 2008Published: Aug 28, 2008
Est. expiryAug 4, 2025(expired)· nominal 20-yr term from priority
H10W 90/756H10W 74/00H10W 72/01515H10W 72/884H10W 72/075H10H 20/8513
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Claims
Abstract
A multi-wavelength LED construction and its manufacturing process having respectively coated on the base layer and the position above the peripheral of the light emitting chip a fluorescent material of a specific wavelength to be excited to provide higher light emitting efficiency and expected light color without mutual interference when the chip is conducted so to facilitate quality control of the multi-wavelength LED.
Claims
exact text as granted — not AI-modified1 - 2 . (canceled)
3 . A manufacturing process of the multi-wavelength LED includes the following steps:
a. The first type of fluorescent material of comparatively longer wavelength is mixed with a gel to become a chip mounting gel to be coated in a carrier of the light-emitting chip; b. The light-emitting chip is fixed in the chip mounting get and baked in positions; c. The light-emitting chip and multiple electrodes are joined; d. The second type of fluorescent material of comparatively shorter wavelength is mixed with the gel to become a fluorescent gel to be poured into the position above the peripheral of the light-emitting chip; and e. Finally, the fluorescent gel is baked in the oven.
4 - 6 . (canceled)
7 . A manufacturing process of the multi-wavelength LED includes the following steps:
a. The first type of fluorescent material of comparatively longer wavelength is mixed with a gel to become a chip mounting gel to be coated in a carrier of the light-emitting chip; b. The light-emitting chip is fixed in the chip mounting gel and baked in position; c. The light-emitting chip and multiple electrodes are joined; d. The second and the third type of fluorescent materials each of comparatively shorter wavelength are mixed with the gel to become a fluorescent gel to be poured into the position above the peripheral of the light-emitting chip; and e. Finally, the fluorescent gel is baked in the oven.
8 - 10 . (canceled)
11 . A manufacturing process of the multi-wavelength LED includes the following steps:
a. The first and the second types of fluorescent materials each of comparatively longer wavelength are respectively mixed with a gel to produce separate gel cakes; b. Both gel cakes are placed into the carrier of the light-emitting chip in sequence, followed with the placement of the light-emitting chip to be baked in position; c. The light-emitting chip and multiple electrodes are joined; d. The third type of fluorescent material of comparatively shorter wavelength is mixed with the gel to become a fluorescent gel to be poured into the position above the peripheral of the light-emitting chip; and e. Finally, the fluorescent gel is baked in position.
12 . A manufacturing process of the multi-wavelength LED includes the following steps:
a. The first and the second types of fluorescent materials each of comparatively longer wavelength are respectively mixed with a gel to produce separate gel cakes; b. Both gel cakes respectively made of the first and the second types of fluorescent materials are baked into position with the chip to become a semi-product; c. The semi-product is placed into the carrier of the light-emitting chip and baked in position; d. The light-emitting chip and multiple electrodes are joined; e. The third type of fluorescent material of comparatively shorter wavelength is mixed with the gel to become a fluorescent gel to be poured into the position above the peripheral of the light-emitting chip; and f. Finally, the fluorescent gel is baked in the oven.Join the waitlist — get patent alerts
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