Apparatus for processing wafer

Abstract

An apparatus for processing wafer is provided, in which a re-adhesion of the slurry to the wafer edge, which has been adhered to the elastic abrasion member, can be inhibited, since a stronger contact of the rotating elastic abrasion member with the wafer edge, which is occurred when the rotating elastic abrasion member enters to the surface of the wafer, is avoided, and further, an abrasion of the elastic abrasion member can be inhibited. The apparatus for processing wafer is an apparatus for processing wafers, wherein a shaft center of the mechanism for rotating the wafer is inclined relative to a shaft center of the abrading-rotating mechanism, so that a distance between the support member and the wafer in a position where the elastic abrasion member enters the inner side of the surface of the wafer from the outer side thereof due to the actuation toward the predetermined direction by the abrading-rotating mechanism is larger than the distance between the support member and the wafer in a position where the elastic abrasion member escapes from the inner side of the surface of the wafer to the outer side thereof.

1 . An apparatus for processing wafers, which is adopted to abrade at least one side of a disc-shaped wafer, comprising:
 a wafer-rotating mechanism, capable of actuating a rotation of said wafer;   an abrasion unit configured to have an elastic abrasion member supported by a support member, said elastic abrasion member being capable of abrading a surface of said wafer; and   an abrading-rotating mechanism for actuating said abrasion unit to be rotated for a predetermined direction to cause a revolution of said elastic abrasion member, in a position where at least a portion of said elastic abrasion member travels between an inner portion in the surface of said wafer and an outer portion thereof,   wherein a shaft center of said wafer-rotating mechanism is inclined relative to a shaft center of said abrading-rotating mechanism, so that a distance between said support member and said wafer in a position where said elastic abrasion member enters the inner side of the surface of said wafer from the outer side thereof due to the actuation toward the predetermined direction by said abrading-rotating mechanism is larger than the distance between said support member and said wafer in a position where said elastic abrasion member escapes from the inner side of the surface of said wafer to the outer side thereof.   
   
   
       2 . The apparatus for processing wafers as set forth in  claim 1 , wherein a plurality of said elastic abrasion members are radially supported by said elastic abrasion member in said abrasion unit. 
   
   
       3 . The apparatus for processing wafers as set forth in  claim 1 , wherein the surface of said wafer is cleaned by abrading the surface with said elastic abrasion member of said abrasion unit. 
   
   
       4 . The apparatus for processing wafers as set forth in  claim 2 , wherein the surface of said wafer is cleaned by abrading the surface with said elastic abrasion member of said abrasion unit.