Diamond polishing disc process

Abstract

A diamond polishing disc process includes the following steps. First, an adhesive material is coated on outer sides of the woven layer with a plurality of meshes, so as to form an adhesive layer. Next, the adhesive layer is adhered in an accommodation unit. Afterwards, pluralities of diamond particles are implanted in the adhesive layer, and are respectively adhered in each mesh of the adhesive layer. Then, a polymer material is filled into the accommodation unit, so as to fix the diamond particles to the polymer material. Finally, cure the polymer material, and remove it with the diamond particles from the accommodation unit, thus obtaining a diamond polishing disc base with the diamond particles arranged uniformly and having consistent in orientations.

1 . A diamond polishing disc process, comprising:
 providing a woven layer having a plurality of meshes, and coating an adhesive material on outer sides of the woven layer so as to form an adhesive layer;   providing an accommodation unit, and adhering the adhesive layer in the accommodation unit;   implanting a plurality of diamond particles on the adhesive layer, the diamond particles are adhered to each of meshes respectively;   filling a polymer material into the accommodation unit to cover the diamond particles, such that the diamond particles are fixed to the polymer material;   curing the polymer material; and   removing the polymer material with the diamond particles together from the accommodation unit.   
     
     
         2 . The diamond polishing disc process as claimed in  claim 1 , further comprising covering a curing gel on the hardened polymer material. 
     
     
         3 . The diamond polishing disc process as claimed in  claim 2 , wherein the curing gel is an UV glue. 
     
     
         4 . The diamond polishing disc process as claimed in  claim 1 , wherein the step of adhering the adhesive layer in the accommodation unit further comprises attaching the adhesive layer to a flat disc, and fitting an outer ring on the flat disc so as to form the accommodation unit. 
     
     
         5 . The diamond polishing disc process as claimed in  claim 4 , wherein the step of attaching the adhesive layer to a flat disc further comprises fitting an alignment fixture on a periphery of the flat disc, and attaching the adhesive layer to the flat disc depending on a hollow area formed by the alignment fixture. 
     
     
         6 . The diamond polishing disc process as claimed in  claim 1 , wherein the woven layer is a nylon net, and the adhesive material is an adhesive tape. 
     
     
         7 . The diamond polishing disc process as claimed in  claim 1 , wherein the polymer material is an epoxy resin. 
     
     
         8 . The diamond polishing disc process as claimed in  claim 1 , wherein a mesh size of the woven layer is between 190 μm to 220 μm. 
     
     
         9 . The diamond polishing disc process as claimed in  claim 1 , wherein a diameter of the diamond particles is between 250 μm to 300 μm. 
     
     
         10 . A manufacturing mold, for implanting a plurality of diamond particles and filling a liquid substrate material so as to manufacture a diamond polishing disc, comprising:
 an accommodation unit, for providing a space for filling the liquid substrate material therein; and   an adhesive layer, disposed in the accommodation unit, and having a nylon net and an adhesive material covered on outer sides of the nylon net, such that the diamond particles are adhered in a plurality of meshes of the adhesive layer.   
     
     
         11 . The manufacturing mold as claimed in  claim 10 , wherein the woven layer is a nylon net, and the adhesive material is an adhesive tape. 
     
     
         12 . The manufacturing mold as claimed in  claim 10 , wherein the substrate material is a polymer material. 
     
     
         13 . The manufacturing mold as claimed in  claim 12 , wherein the polymer material is an epoxy resin. 
     
     
         14 . The manufacturing mold as claimed in  claim 10 , wherein the meshes of the woven layer are of the same size or different sizes. 
     
     
         15 . The manufacturing mold as claimed in  claim 10 , wherein a mesh size of the woven layer is between 190 μm to 220 μm. 
     
     
         16 . The manufacturing mold as claimed in  claim 10 , wherein a diameter of the diamond particles is between 250 μm to 300 μm. 
     
     
         17 . The manufacturing mold as claimed in  claim 10 , wherein the accommodation unit further comprises:
 a flat disc, on which the adhesive layer is attached; and   an outer ring, having a hollow structure corresponding to the flat disc, and fitted on the flat disc to form an accommodation space.   
     
     
         18 . The manufacturing mold as claimed in  claim 17 , wherein the flat disc further comprises a protrusion. 
     
     
         19 . The manufacturing mold as claimed in  claim 17 , wherein the flat disc further comprises a recess.