Producing method of solid state pickup device, and attaching method and device for the same

Abstract

A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

1 . A solid state pickup device, comprising:
 an imaging element on a wafer, the imaging element including a light receiving surface and a plurality of contact points; and   a shield glass with a receiving surface border portion protruding therefrom, wherein said receiving surface border portion and said shield glass are formed from a same glass plate,   wherein said wafer is attached to said receiving surface border portion of said shield glass such that said light receiving surface of said wafer is surrounded by said receiving surface border portion.   
   
   
       2 . The device as defined in  claim 1 , wherein said light receiving surface has substantially a quadrilateral shape, and said receiving surface border portions protrude substantially in a quadrilateral shape in a position about said light receiving surface. 
   
   
       3 . The device as defined in  claim 2 , wherein said plurality of contact points are disposed outside said light receiving surface and outside a covered area of said shield glass. 
   
   
       4 . The device as defined in  claim 1 , wherein a space exists between said light receiving surface of said wafer and an inner surface of said shield glass. 
   
   
       5 . The device as defined in  claim 1 , wherein a surface area of said shield glass is not aligned with a surface area of said wafer. 
   
   
       6 . The device as defined in  claim 1 , wherein said receiving surface border portions of said shield glass is attached to said wafer on a portion of a surface of said wafer between said light receiving surface and said plurality of contact points.