Vapor-Augmented Heat Spreader Device

Abstract

A vapor-augmented heat spreader device includes a lower sheet in communication with an upper sheet. The lower sheet includes condensate grooves formed into the upper surface and the upper sheet includes a series of vapor grooves formed therein. The dimensions of the condensate grooves differ from the dimensions of the vapor grooves. For example, the condensate grooves may have dimensions smaller than those of the vapor grooves. The lower sheet may further include a multi-wick structure in communication with the condensate grooves. The lower sheet may be coupled to the upper sheet utilizing one or more of a crest joint or an edge joint.

1 . A heat transfer device comprising:
 a first fluid transfer element including:
 a first surface and a second surface, and 
 at least one vapor groove formed into the second surface of the first element to allow for the condensation and passage of a vapor generated by a vaporizable liquid; and 
   a second fluid transfer element in communication with the first fluid transfer element, the second fluid transfer element including:
 a third surface and a fourth surface, and 
 at least one condensate groove formed into the third surface of the second element, wherein the condensate grieve is configured to transport the vaporizable liquid, 
   wherein the capillary force generated by the at least one condensate groove is higher than the capillary force generated by the at least one vapor groove.   
   
   
       2 . The heat transfer device of  claim 1 , wherein the dimensions of the at least one vapor groove differs from the dimensions of the at least one condensate groove. 
   
   
       3 . The heat transfer device of  claim 2 , wherein the size of the at least one condensate groove is smaller than the size of the at least one vapor groove. 
   
   
       4 . The heat transfer device of  claim 2 , wherein the geometry/shape of the at least one condensate groove differs from the geometry of the at least one vapor groove. 
   
   
       5 . The heat transfer device of  claim 4 , wherein:
 the at least one condensate groove possesses a geometry including a sharp corner; and   the at least one vapor groove possesses a rounded shape.   
   
   
       6 . The heat transfer device of  claim 1 , wherein the at least one vapor groove possesses a rounded shape and the at least one condensate groove possesses a polygonal shape. 
   
   
       7 . The heat transfer device of  claim 1 , wherein:
 the second fluid transfer element defines an evaporation region;   the second fluid transfer element further comprises a multi-wick structure having a wicking power that increases with decreasing distance to the evaporation region.   
   
   
       8 . The heat transfer device of  claim 7 , wherein:
 the second fluid transfer element includes an evaporation region, and   the multi-wick structure is a boiling enhancement multi-wick structure formed over the evaporation region.   
   
   
       9 . The heat transfer device of  claim 1 , wherein:
 the at least one condensate groove possesses a shape selected from the group consisting of a rounded shape and a polygonal shape; and   the at least one vapor groove possesses a shape selected from the group consisting of: a rounded shape and a polygonal shape.   
   
   
       10 . The heat transfer device of  claim 1  further comprising an air groove formed into at least one of the first surface of the first fluid transfer element or the fourth surface of the second fluid transfer element. 
   
   
       11 . The heat transfer device of  claim 1 , wherein:
 the at least one vapor groove comprises a plurality of grooves spaced apart so as to define a plurality of crests between the grooves; and   the at least one condensate groove comprises a plurality of grooves spaced apart so as to define a plurality of crests between the grooves,   wherein the crests of the first fluid transfer element and the crests of the second fluid transfer element are selectively joined to form crest joints.   
   
   
       12 . The heat transfer device of  claim 1  further comprising an edge joint coupling the first fluid transfer element to the second fluid transfer element such that a fluid tight seal is created. 
   
   
       13 . The heat transfer device of  claim 1 , wherein:
 the overall vapor groove structure pattern is selected from the group consisting of a grid pattern, a leaf-vein pattern, and combinations thereof; and   the overall condensate groove structure pattern is selected from the group consisting of a grid pattern, a leaf-vein pattern, a multi-wick structure patent, and combinations thereof.   
   
   
       14 . The heat transfer device of  claim 1  further comprising a vaporizable liquid housed within the transfer device. 
   
   
       15 . The heat transfer device of  claim 1 , wherein:
 the second fluid transfer element defines an evaporation region; and   the condensate groove is configured to transport the liquid toward the evaporation region.   
   
   
       16 . A heat transfer device comprising:
 a first fluid transfer element including:
 a first surface and a second surface, 
 a plurality of condensate grooves formed into the second surface of the first element, wherein the condensate grooves are spaced to form a plurality of crests defined by the area between the grooves; and 
   a second fluid transfer element including:
 a third surface and a fourth surface, and 
 a plurality of vapor grooves formed into the first surface of the second element, wherein the vapor grooves are spaced to form a plurality of crests defined by the area between the grooves, 
   wherein one or more of the crests of the first fluid transfer element selectively contact one or more of the crests of the second fluid transfer element to form one or more contact areas.   
   
   
       17 . The heat transfer device of  claim 16 , wherein the capillary force generated by each of the plurality of condensate grooves is higher than the capillary force generated by each of the plurality of vapor grooves. 
   
   
       18 . The heat transfer device of  claim 16 , wherein the dimensions of the plurality of vapor grooves differs from the dimensions of the plurality of condensate grooves. 
   
   
       19 . The heat transfer device of  claim 18 , wherein each of the plurality of condensate grooves is sized smaller than each of the plurality of vapor grooves. 
   
   
       20 . The heat transfer device of  claim 18 , wherein the plurality of condensate grooves possesses a shape that differs from the shape of the plurality of vapor grooves. 
   
   
       21 . The heat transfer device of  claim 16 , wherein the second fluid transfer element further comprises a multi-wick structure in communication with the condensate grooves, the multi-wick structure being formed into the third surface of the second fluid transfer element. 
   
   
       22 . The heat transfer device of  claim 21 , wherein:
 the second fluid transfer element includes an evaporation region, and   the multi-wick structure is a boiling enhancement multi-wick structure disposed over the evaporation region.   
   
   
       23 . The heat transfer device of  claim 16 , wherein:
 each of the vapor grooves possesses a shape selected from the group consisting of a rounded shape and a polygonal shape; and   each of the condensate grooves possesses a shape selected from the group consisting of a rounded shape and a polygonal shape.   
   
   
       24 . The heat transfer device of  claim 16 , wherein:
 the overall vapor groove structure pattern is selected from the group consisting of a grid pattern, a leaf-vein pattern, and combinations thereof; and   the overall condensate groove structure pattern is selected from the group consisting of a grid pattern, a leaf-vein pattern, a multi-wick structure, and combinations thereof.   
   
   
       25 . The heat transfer device of  claim 16 , further comprising an air groove formed into at least one of the first surface of the first fluid transfer element or the fourth surface of the second fluid transfer element. 
   
   
       26 . The heat transfer device of  claim 16  further comprising an edge joint coupling the first fluid transfer element to the second fluid transfer element such that a fluid tight seal is created. 
   
   
       27 . The heat transfer device of  claim 16  further comprising a vaporizable liquid housed within the transfer device. 
   
   
       28 . The heat transfer device of  claim 16 , wherein:
 the second fluid transfer element defines an evaporation region; and   the condensate grooves are configured to transport the liquid toward the evaporation region.   
   
   
       29 . The heat transfer device of  claim 16 , wherein at least about 10% of areas forming the contact areas are functionally joined together to form crest joints. 
   
   
       30 . The heat transfer device of  claim 16 , wherein:
 the plurality of condensate grooves comprises condensate grooves possessing a shape including a sharp corner; and   the plurality of vapor grooves comprises grooves possessing a rounded shape.   
   
   
       31 . A method of forming a vapor chamber device to minimize pressure forces while maintaining vapor spreading capabilities, the method comprising:
 (a) providing a first fluid transfer element including a first surface and a second surface;   (b) forming at least one vapor channel into the second surface of the first element, wherein the vapor channel allows the condensation and passage of a vapor generated by a vaporizable fluid;   (c) providing a second fluid transfer element in communication with the first fluid transfer element, the second fluid transfer element including a third surface and a fourth surface; and   (d) forming at least one condensate channel into the third surface of the second element, the condensate channel being operable to transport the vaporizable fluid,   wherein the capillary force of the at least one condensate channel is higher than the capillary force of the at least one vapor channel.   
   
   
       32 . The method of  claim 31  further comprising:
 (e) sealing the heat transfer device to form a fluid tight seal; and   (f) charging the heat transfer device with the vaporizable liquid.   
   
   
       33 . A method of forming a vapor chamber device, the method comprising:
 (a) providing a first fluid transfer element including a first surface and a second surface;   (b) forming a plurality of condensate channels into the second surface of the first element, wherein the condensate channels are spaced to form a plurality of crests defined by the area between the channels;   (c) providing a second fluid transfer element including a third surface and a fourth surface;   (d) forming a plurality of vapor channels into the third surface of the second element, wherein the vapor channels are spaced to form a plurality of crests defined by the area between the channels; and   (e) selectively contacting one or more of the crests of the first fluid transfer element with one or more of the crests of the second fluid transfer element to form contact areas with the vapor chamber.   
   
   
       34 . The method of  claim 33  further comprising (f) sealing the contact areas together to form a crest joint.