US2008217180A1PendingUtilityA1

Surface with an Anti-Adhesion Microstructure and Method for Producing Same

Assignee: SIEMENS AGPriority: Aug 26, 2004Filed: Aug 8, 2005Published: Sep 11, 2008
Est. expiryAug 26, 2024(expired)· nominal 20-yr term from priority
C25D 5/605C25D 5/18
48
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Claims

Abstract

The invention relates to a surface comprising a microstructure that reduces adhesion and to a method for producing said microstructure. Microstructures of this type that reduce adhesion are known and are used, for example, to configure self-cleaning surfaces that us the Lotus effect. According to the invention, the surface is produced electrochemically by means of reverse pulse plating, the known microstructure being first produced and a nanostructure that is overlaid on the microstructure is produced at the same time or in a subsequent step. To achieve this for example, the pulse length of the current pulse that is used during the reverse pulse plating lies in the millisecond range and has a pulse length ratio greater than 1:3. The microstructure that has been produced, consisting of peaks and troughs is then overlaid with peaks and troughs of a smaller size order belonging to the nanostructure.

Claims

exact text as granted — not AI-modified
1 .- 9 . (canceled) 
     
     
         10 . A method for electrochemically producing a surface with an anti-adhesion microstructure, comprising:
 providing a macrostructure;   arranging a microstructure on the macrostructure by electrochemical pulse plating; and   arranging a nanostructure on the microstructure by reverse pulse plating.   
     
     
         11 . The method as claimed in  claim 10 , wherein the reverse pulse plating pulse length for producing the nanostructure is less than 500 ms. 
     
     
         12 . The method as claimed in  claim 11 , wherein a cathodic pulse is at least three times as long as an anodic pulse for reverse pulse plating. 
     
     
         13 . The method as claimed in  claim 12 , wherein the cathodic pulse is implemented with a higher current density than the anodic pulse for reverse pulse plating. 
     
     
         14 . The method as claimed in  claim 13 , wherein the pulse length for an upstream process step for producing the microstructure is at least one second. 
     
     
         15 . A surface with an anti-adhesion microstructure, comprising:
 providing a microstructure; and   superimposing a nanostructure on the microstructure by pulse plating to produce the surface.   
     
     
         16 . The surface as claimed in  claim 15 , wherein the surface is superhydrophobic. 
     
     
         17 . The surface as claimed in  claim 16 , wherein a macrostructure is superimposed on the microstructure and the nanostructure. 
     
     
         18 . The surface as claimed in  claim 17 , wherein a pulse plating pulse length for producing the nanostructure is less than 500 ms.

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