Melt-based patterning for electronic devices

Abstract

The present invention provides methods and apparatus for melt-based patterning for electronic devices. It employs and provides processes and apparatus for fabricating an electronic device having a pattern formed on a surface by a deposition material. Further, the invention a process for fabricating semiconductors, organic light-emitting devices (OLEDs), field-effect transistors, and in particular high-resolution patterning for RGB displays. A process for fabricating an organic electronic device includes the steps of heating and applying a pressure to the deposition material to form a melt, and depositing the melted deposition material on the surface with a phase-change printing technique or a spray technique. The melted deposition material solidifies on the surface.

1 . A process comprising fabricating an electronic device having a pattern formed on a surface by a deposition material, the step of fabricating comprising the steps of:
 heating and applying a pressure to the deposition material without requiring a solvent to be present to form a melt;   depositing the melted deposition material on the surface with one of a phase-change printing technique and a spray technique,   wherein the melted deposition material solidifies on the surface in a single phase transition from the melt to a solid.   
     
     
         2 . The process according to  claim 1 ,
 wherein the deposition material is selected to comprise one of: an organic material an OLED material, biological molecules, nanoparticles, and any combination of these materials,   wherein in the step of heating and applying a pressure is performed in a pressure chamber, and   further comprising repeating the steps of heating and depositing to deposit multiple layers of the deposition material, wherein the multiple layers are formed by depositing different deposition materials.   
     
     
         3 . The process according to  claim 1 , further comprising repeating the steps of heating and depositing to deposit multiple layers of the deposition material. 
     
     
         4 . The process according to  claim 3 , wherein the multiple layers are formed by depositing different deposition materials. 
     
     
         5 . The process according to  claim 1 , wherein the deposition material is selected to comprise one of: an organic material; an OLED material; biological molecules; nanoparticles; and any combination of these materials. 
     
     
         6 . The process according to  claim 1 , wherein the deposition material is selected to comprise a composition in form of a powder. 
     
     
         7 . The process according to  claim 1 , wherein the deposition material is provided as a pellet. 
     
     
         8 . The process according to  claim 1 , used to fabricate one of: an organic light-emitting device; a monochrome and/or color display; a biological pattern; a biochip; a sensor; a semiconductor device; and a circuit. 
     
     
         9 . A process for fabricating a field-effect transistor comprising the steps of:
 forming source and drain contacts on a substrate;   heating and applying a pressure to a deposition material without requiring a solvent to be present to form a melt, the deposition material comprising an organic semiconducting material;   depositing the melted deposition material onto the substrate with the source and drain contacts by one of: a phase-change printing technique; and a spray technique, wherein the melted deposition material solidifies on the substrate and forms an organic semiconducting layer in a single phase transition from the melt to a solid;   forming an insulating layer on the organic semiconducting layer; and   forming a gate contact on the insulating layer.   
     
     
         10 . An apparatus to fabricate an electronic device having a pattern formed on a surface by a deposition material, the process comprising:
 means for heating and applying a pressure to the deposition material without requiring a solvent to be present to form a melt; and   means for depositing the melted deposition material on the surface with one of: a phase-change printing technique; and a spray technique,   wherein the melted deposition material solidifies on the surface in a single phase transition from the melt to a solid.   
     
     
         11 . The process according to  claim 1 , wherein the means for heating and applying a pressure is performed in a pressure chamber, and
 further comprising repeating the steps of heating and depositing to deposit multiple layers of the deposition material, wherein the multiple layers are formed by depositing different deposition materials.   
     
     
         12 . An apparatus to fabricate a field-effect transistor comprising:
 means for forming source and drain contacts on a substrate;   means for heating and applying a pressure to a deposition material without requiring a solvent to be present to form a melt, the deposition material comprising an organic semiconducting material;   means for depositing the melted deposition material onto the substrate with the source and drain contacts by one of a phase-change printing technique, and a spray technique, wherein the melted deposition material solidifies on the substrate and forms an organic semiconducting layer;   means for forming an insulating layer on the organic semiconducting layer; and   means for forming a gate contact on the insulating layer.   
     
     
         13 . The process according to  claim 12 , further comprising repeating the steps of heating and depositing to deposit multiple layers of the deposition material. 
     
     
         14 . The process according to  claim 9 , wherein the step of heating and applying a pressure is performed in a pressure chamber. 
     
     
         15 . The process according to  claim 14 , further comprising repeating the steps of heating and depositing to deposit multiple layers of the deposition material. 
     
     
         16 . The process according to  claim 15 , wherein the multiple layers are formed by depositing different deposition materials. 
     
     
         17 . The process according to  claim 9 , wherein the deposition material is selected to comprise one of: an organic material; an OLED material; biological molecules; nanoparticles; and any combination of these materials. 
     
     
         18 . The process according to  claim 9 , wherein the deposition material is selected to comprise a composition in form of a powder. 
     
     
         19 . The apparatus according to  claim 10 , wherein the device is one of: an organic light-emitting device, a monochrome and/or color display, a biological pattern, a biochip, a sensor, a semiconductor device, and a circuit. 
     
     
         20 . The apparatus according to  claim 10 , wherein multiple layers are formed by the means for depositing depositing different deposition materials.