Novel thin laminate as embedded capacitance material in printed circuit boards

Abstract

The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The multilayered structure comprises a pair of parallel electrically conductive layers separated by a pair of dielectric layers and a central polymerizable layer. Each of the dielectric layers and the central layer may include a filler. Capacitors formed from the multilayered structures of the invention exhibit excellent short circuit resistance as well as excellent void resistance.

1 - 33 . (canceled) 
     
     
         34 . A process for forming a multilayered construction suitable for forming capacitors which comprises:
 a) applying a first thermosetting polymer layer onto a surface of a first electrically conductive layer;   b) applying a central polymerizable layer onto a surface of the first thermosetting polymer layer;   c) applying a second thermosetting polymer layer onto a surface of a second electrically conductive layer; thereafter   d) attaching the first electrically conductive layer to the second electrically conductive layer such that each of the first and second thermosetting polymer layers and the central polymerizable layer are positioned between the first and second electrically conductive layers; and thereafter   e) polymerizing said polymerizable layer;   wherein each of said first thermosetting polymer layer, said second thermosetting polymer layer and said central polymerizable layer optionally further comprises a filler material.   
     
     
         35 . The process of  claim 34  wherein the first and second thermosetting polymer layers are applied as liquids onto the first and second electrically conductive layers. 
     
     
         36 . The process of  claim 34  wherein the first and second thermosetting polymer layers are applied as liquids onto the first and second electrically conductive layers and then at least partially dried. 
     
     
         37 - 47 . (canceled) 
     
     
         48 . The process of  claim 34  wherein at least one of said first thermosetting polymer layer, said second thermosetting polymer layer and said central polymerizable layer further comprises a filler material. 
     
     
         49 . The process of  claim 34  wherein said filler material comprises a material selected from the group consisting of ceramics, barium titanate, boron nitride, aluminum oxide, silica, strontium titanate, barium strontium titanate, quartz and combinations thereof. 
     
     
         50 . The process of  claim 34  wherein said filler material comprises barium titanate. 
     
     
         51 . The process of  claim 34  wherein at least one of said first thermosetting polymer layer, said second thermosetting polymer layer and said central polymerizable layer further comprises from about 1% to about 90% by weight of a filler material. 
     
     
         52 . The process of  claim 34  wherein the first electrically conductive layer and the second electrically conductive layer independently comprise a material selected from the group consisting of copper, zinc, brass, chrome, nickel, aluminum, stainless steel, iron, gold, silver, titanium, platinum and combinations thereof. 
     
     
         53 . The process of  claim 34  wherein each of the first electrically conductive layer and the second electrically conductive layer comprises copper. 
     
     
         54 . The process of  claim 34  wherein one or both of the first thermosetting polymer layer and the second thermosetting polymer layer comprise a material selected from the group consisting of an epoxy, a melamine, polyesters, polyester containing copolymers, a urethane, alkyd, a bis-maleimide triazine, a polyimide, an ester, polyarylene ethers, fluorinated polyarylene ethers, benzocyclobutenes, liquid crystal polymers, an allyated polyphenylene ethers, amines and combinations thereof. 
     
     
         55 . The process of  claim 34  wherein both of the first thermosetting polymer layer and the second thermosetting polymer layer comprise an epoxy. 
     
     
         56 . The process of  claim 34  wherein the central polymerizable layer comprises a polymerizable precursor of a polyethylene terephthalate, a polyethylene naphthalate, a polyvinyl carbazole, a polyphenylene sulfide, an aromatic polyamide, a polyimide, a polyamide-polyimide, a polyether-nitrile, a polyether-ether-ketone, or combinations thereof. 
     
     
         57 . The process of  claim 34  wherein said central polymerizable layer comprises a polymerizable polyamide precursor. 
     
     
         58 . The process of  claim 34  wherein said central polymerizable layer comprises a polymerizable polyimide precursor. 
     
     
         59 . The process of  claim 34  wherein said central polymerizable layer comprises a combination of a polyamide precursor and a polyimide precursor. 
     
     
         60 . The process of  claim 34  wherein a multilayered construction formed according to the process has a capacitance of from about 100 pF/cm 2  to about 4,000 pF/cm 2 . 
     
     
         61 . The process of  claim 34  wherein the dielectric constant of each of the first thermosetting polymer layer, second thermosetting polymer layer and central polymerizable layer is from about 3 to about 65. 
     
     
         62 . The process of  claim 34  wherein the Tg of said thermosetting polymer layers is at least about 180° C. 
     
     
         63 . The process of  claim 34  wherein the Tg of said central polymerizable layer is at least about 220° C. 
     
     
         64 . The process of  claim 34  wherein each of said first and second electrically conductive layers comprise copper foils, each of said first and second thermosetting polymer layers comprise an epoxy and said central polymerizable layer comprises a polymerizable polyamide precursor, a polymerizable polyimide precursor or a combination of a polymerizable polyamide precursor and a polymerizable polyimide precursor.