Method and apparatus for cooling integrated circuit chips using recycled power

Abstract

One embodiment of the present invention provides a system that cools integrated circuit (IC) chips within a computer system. During operation, the system converts heat generated by a heat-generating-device within the computer system into thermoelectric power. The system then supplies the thermoelectric power to an IC chip as a cooling power to reduce the operating temperature of the IC chip, thereby recycling wasted energy within the computer system.

1 . A method for cooling integrated circuit (IC) chips within a computer system, comprising:
 converting heat generated by a heat-generating-device within the computer system during operation of the computer system into thermoelectric power; and   supplying the thermoelectric power to an IC chip as a cooling power to reduce the operating temperature of the IC chip, thereby recycling wasted energy within the computer system.   
   
   
       2 . The method of  claim 1 , wherein converting the heat generated by the heat-generating-device into the thermoelectric power involves:
 tapping into a temperature difference around the heat-generating-device; and   converting the temperature difference into electricity using the Seebeck effect.   
   
   
       3 . The method of  claim 2 , wherein tapping into the temperature difference around the heat-generating-device involves:
 tapping into a first temperature reference on the heat-generating-device; and   tapping into a second temperature reference from a heat sink, which has a lower temperature than the heat-generating-device.   
   
   
       4 . The method of  claim 3 , wherein the method further comprises increasing the temperature difference by reducing the temperature of the second temperature reference. 
   
   
       5 . The method of  claim 4 , wherein reducing the temperature of the second temperature reference involves using heat pipes to reduce the temperature. 
   
   
       6 . The method of  claim 3 ,
 wherein tapping into the first temperature reference involves coupling a first thermal interface of a thermoelectric module to the heat-generating-device; and   wherein tapping into the second temperature reference involves coupling a second thermal interface of the thermoelectric module to the heat sink; and   wherein the temperature difference between the first thermal interface and the second thermal interface creates a voltage difference between the first and second thermal interfaces.   
   
   
       7 . The method of  claim 6 , wherein the thermoelectric module can be a bulk thermoelectric device or a thin film thermoelectric device. 
   
   
       8 . The method of  claim 1 , wherein supplying the thermoelectric power to the IC chip as the cooling power involves using the Peltier effect, which involves:
 coupling the IC chip to a first surface of a thermoelectric cooling module; and   driving the thermoelectric cooling module using the generated thermoelectric power, so that the thermoelectric cooling module actively absorbs heat from the IC chip and releases the heat from a second surface.   
   
   
       9 . The method of  claim 8 , wherein the thermoelectric cooling module is a thin film thermoelectric element suitable for cooling a high temperature spot within the second IC chip. 
   
   
       10 . The method of  claim 1 , further comprising:
 converting heat generated by a number of heat-generating-devices into thermoelectric power for each heat-generating-device; and   combining the thermoelectric power for each heat-generating-device into an aggregate thermoelectric power.   
   
   
       11 . The method of  claim 10 , wherein the method further comprises:
 monitoring the operating temperature of the IC chip using a continuous system telemetry harness (CSTH); and   controlling the thermoelectric power supplied to the IC chip based on the monitored operating temperature by varying the number of heat-generating-devices used to generate the thermoelectric power.   
   
   
       12 . The method of  claim 1 , wherein the heat-generating-device can include:
 a microprocessor chip package;   a graphics processor chip package;   an ASIC chip package;   a video processor chip package;   a DSP chip package;   a memory chip package;   a hard disk drive;   a power supply;   a graphic card; and   any other heat source within the computer system.   
   
   
       13 . The method of  claim 1 , wherein the IC chip can include:
 a microprocessor chip;   a graphics processor chip;   an ASIC chip;   a video processor chip;   a DSP chip package; and   a memory chip.   
   
   
       14 . An apparatus that cools integrated circuit (IC) chips within a computer system, comprising:
 an energy-conversion mechanism configured to convert heat generated by a heat-generating-device within the computer system during operation of the computer system into thermoelectric power; and   a power-supplying mechanism configured to supply the thermoelectric power to an IC chip as a cooling power to reduce the operating temperature of the IC chip, thereby recycling wasted energy within the computer system.   
   
   
       15 . The apparatus of  claim 14 , wherein the energy-conversion mechanism is configured to:
 tap into a temperature difference around the heat-generating-device; and   convert the temperature difference into electricity using the Seebeck effect.   
   
   
       16 . The apparatus of  claim 15 , wherein while tapping into the temperature difference around the heat-generating-device, the energy-conversion mechanism is further configured to:
 tap into a first temperature reference on the heat-generating-device; and   tap into a second temperature reference from a heat sink, which has a lower temperature than the heat-generating-device.   
   
   
       17 . The apparatus of  claim 16 , wherein the energy-conversion mechanism is configured to increase the temperature difference by reducing the temperature of the second temperature reference. 
   
   
       18 . The apparatus of  claim 17 , wherein the energy-conversion mechanism is configured to reduce the temperature of the second temperature reference by using heat pipes to reduce the temperature. 
   
   
       19 . The apparatus of  claim 16 , wherein the energy-conversion mechanism is configured to:
 tap into the first temperature reference by coupling a first thermal interface of a thermoelectric module to the heat-generating-device; and   tap into the second temperature reference by coupling a second thermal interface of the thermoelectric module to the heat sink; and   wherein the temperature difference between the first thermal interface and the second thermal interface creates a voltage difference between the first and second thermal interfaces.   
   
   
       20 . The apparatus of  claim 19 , wherein the thermoelectric module can be a bulk thermoelectric device or a thin film thermoelectric device. 
   
   
       21 . The apparatus of  claim 14 , wherein the power-supplying mechanism is configured to supply the thermoelectric power to the IC chip by using the Peltier effect, wherein the power-supplying mechanism further comprises:
 a coupling mechanism configured to couple the IC chip to a first surface of a thermoelectric cooling module; and   a driving mechanism configured to drive the thermoelectric cooling module using the generated thermoelectric power, so that the thermoelectric cooling module actively absorbs heat from the IC chip and releases the heat from a second surface.   
   
   
       22 . The apparatus of  claim 21 , wherein the thermoelectric cooling module is a thin film thermoelectric element suitable for cooling a high temperature spot within the second IC chip. 
   
   
       23 . The apparatus of  claim 14 , further comprising:
 a second conversion mechanism configured to convert heat generated by a number of heat-generating-devices into thermoelectric power for each heat-generating-device; and   a combining mechanism configured to combine the thermoelectric power for each heat-generating-device into an aggregate thermoelectric power.   
   
   
       24 . The apparatus of  claim 23 , further comprising:
 a monitoring mechanism configured to monitor the operating temperature of the IC chip using a continuous system telemetry harness (CSTH); and   a controlling mechanism configured to control the thermoelectric power supplied to the IC chip based on the monitored operating temperature by varying the number of heat-generating-devices used to generate the thermoelectric power.   
   
   
       25 . The apparatus of  claim 14 , wherein the heat-generating-device can include:
 a microprocessor chip package;   a graphics processor chip package;   an ASIC chip package;   a video processor chip package;   a DSP chip package;   a memory chip package;   a hard disk drive;   a power supply;   a graphic card; and   any other heat source within the computer system.   
   
   
       26 . The apparatus of  claim 14 , wherein the IC chip can include:
 a microprocessor chip;   a graphics processor chip;   an ASIC chip;   a video processor chip;   a DSP chip package; and   a memory chip.