Substrate treating apparatus
Abstract
A substrate treating apparatus for treating substrates with treating liquids. The apparatus includes a treating tank for storing the treating liquids, a holding mechanism for holding the substrates and placing the substrates in a treating position inside the treating tank, a first treating liquid supply device for supplying a first treating liquid into the treating tank, a second treating liquid supply device for supplying a second treating liquid of lower surface tension than the first treating liquid, and higher boiling point than the first treating liquid, into the treating tank, a temperature control device for controlling temperature of the second treating liquid in the treating tank to be in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid, and a control device for controlling the second treating liquid supply device to replace the first treating liquid supplied from the first treating liquid supply device and stored in the treating tank with the second treating liquid, and controlling the temperature control device to maintain the second treating liquid in the temperature range.
Claims
exact text as granted — not AI-modified1 . A substrate treating apparatus for treating substrates with treating liquids, comprising:
a treating tank for storing the treating liquids; a holding mechanism for holding the substrates and placing the substrates in a treating position inside said treating tank; a first treating liquid supply device for supplying a first treating liquid into said treating tank; a second treating liquid supply device for supplying a second treating liquid of lower surface tension than the first treating liquid and higher boiling point than the first treating liquid, into said treating tank; a temperature control device for controlling temperature of the second treating liquid in said treating tank to be in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid; and a control device for controlling said second treating liquid supply device to replace the first treating liquid supplied from said first treating liquid supply device and stored in said treating tank with the second treating liquid, and controlling said temperature control device to maintain the second treating liquid in said temperature range.
2 . An apparatus as defined in claim 1 , further comprising a third treating liquid supply device for supplying a third treating liquid of lower surface tension than the first treating liquid, and lower boiling point than the second treating liquid, into said treating tank;
wherein said holding mechanism is vertically movable, while holding the substrates, between the treating position inside said treating tank and a standby position above said treating tank; and wherein said control device is arranged to control said third treating liquid supply device to replace the second treating liquid stored in said treating tank with the third treating liquid after substrate treatment with the second treating liquid maintained in said temperature range, and to control said holding mechanism to raise the substrates to the standby position after replacement with the third treating liquid inside said treating tank.
3 . An apparatus as defined in claim 1 , further comprising a thermal drying device for drying the substrates having undergone treatment with the second treating liquid in a hot atmosphere;
wherein said control device is arranged to control said thermal drying device to dry the substrates in the hot atmosphere after treatment with the second treating liquid maintained in said temperature range.
4 . An apparatus as defined in claim 1 , further comprising an air drying device for drying, by air contact, the substrates having undergone treatment with the second treating liquid;
wherein said control device is arranged to control said air drying device to dry the substrates by air contact after treatment with the second treating liquid maintained in said temperature range.
5 . An apparatus as defined in claim 1 , wherein the first treating liquid is deionized water, and the second treating liquid has surface tension equal to or less than 0.02 [N/m].
6 . An apparatus as defined in claim 2 , wherein the first treating liquid is deionized water, and the second treating liquid has surface tension equal to or less than 0.02 [N/m].
7 . An apparatus as defined in claim 3 , wherein the first treating liquid is deionized water, and the second treating liquid has surface tension equal to or less than 0.02 [N/m].
8 . An apparatus as defined in claim 4 , wherein the first treating liquid is deionized water, and the second treating liquid has surface tension equal to or less than 0.02 [N/m].
9 . An apparatus as defined in claim 1 , wherein the first treating liquid is deionized water, and the second treating liquid is a fluoric inactive liquid.
10 . An apparatus as defined in claim 2 , wherein the first treating liquid is deionized water, and the second treating liquid is a fluoric inactive liquid.
11 . An apparatus as defined in claim 3 , wherein the first treating liquid is deionized water, and the second treating liquid is a fluoric inactive liquid.
12 . An apparatus as defined in claim 4 , wherein the first treating liquid is deionized water, and the second treating liquid is a fluoric inactive liquid.
13 . An apparatus as defined in claim 2 , wherein the first treating liquid is deionized water, and the second treating liquid and the third treating liquids are fluoric inactive liquids having surface tension equal to or less than 0.02 [N/m].
14 . A substrate treating apparatus for treating substrates with treating liquids, comprising:
a treating unit having a spin holding mechanism disposed therein for spinnably holding a substrate in horizontal posture, said treating unit treating the substrate held by said spin holding mechanism with the treating liquids; a first treating liquid supply device for supplying a first treating liquid to the substrate spun by said spin holding mechanism inside said treating unit; a second treating liquid supply device for supplying a second treating liquid of lower surface tension than the first treating liquid, and higher boiling point than the first treating liquid, to the substrate spun by said spin holding mechanism inside said treating unit; a temperature control device for controlling temperature of the second treating liquid supplied to the substrate spun by said spin holding mechanism inside said treating unit to be in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid; and a control device for controlling said temperature control device said second treating liquid supply device to supply the second treating liquid in said temperature range to the substrate spun by said spin holding mechanism inside said treating unit after treatment of the substrate with the first treating liquid.
15 . An apparatus as defined in claim 14 , further comprising a third treating liquid supply device for supplying a third treating liquid of lower surface tension than the first treating liquid, and lower boiling point than the second treating liquid, to the substrate spun by said spin holding mechanism inside said treating unit;
wherein said control device is arranged to control said third treating liquid supply device to supply the third treating liquid to the substrate spun by said spin holding mechanism inside said treating unit after substrate treatment with the second treating liquid maintained in said temperature range, and to control said spin holding mechanism to spin the substrates after completion of supply of the third treating liquid to the substrate.
16 . An apparatus as defined in claim 14 , wherein the first treating liquid is deionized water, and the second treating liquid has surface tension equal to or less than 0.02 [N/m].
17 . An apparatus as defined in claim 15 , wherein the first treating liquid is deionized water, and the second treating liquid has surface tension equal to or less than 0.02 [N/m].
18 . An apparatus as defined in claim 14 , wherein the first treating liquid is deionized water, and the second treating liquid is a fluoric inactive liquid.
19 . An apparatus as defined in claim 15 , wherein the first treating liquid is deionized water, and the second treating liquid is a fluoric inactive liquid.
20 . An apparatus as defined in claim 15 , wherein the first treating liquid is deionized water, and the second treating liquid and the third treating liquids are fluoric inactive liquids having surface tension equal to or less than 0.02 [N/m].Join the waitlist — get patent alerts
Track US2008230101A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.