Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers

Abstract

Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imager die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.

1 - 32 . (canceled) 
   
   
       33 . A microelectronic imager die comprising:
 a substrate;   a microelectronic image sensor at one side of the substrate, the microelectronic image sensor having a face for receiving radiation;   integrated circuitry electronically coupled to the image sensor; and   a flexor unit that bends a portion of the substrate and the image sensor.   
   
   
       34 . The imager die of  claim 33  wherein the flexor unit further comprises:
 a first element attached to a backside of the substrate under a central portion of the image sensor; and   a spacer attached to the backside of the substrate outward of the first element.   
   
   
       35 . The imager die of  claim 34  -wherein the first element has a first coefficient of thermal expansion and the spacer has a different second coefficient of thermal expansion. 
   
   
       36 . The imager die of  claim 34  wherein the first element is a first compliant material and the spacer is a second compliant material. 
   
   
       37 . The imager die of  claim 33  wherein the flexor unit comprises a compartment attached to the backside of the substrate and a fluid in the compartment at a pressure that causes the substrate to bow. 
   
   
       38 . The imager die of  claim 33  wherein the flexor unit comprises a sealed compartment over the image sensor and fluid in the compartment at a pressure that causes the substrate to bow. 
   
   
       39 . The imager die of  claim 33  wherein the flexor unit comprises a material attached to the backside of the substrate that induces a force that bends the substrate. 
   
   
       40 . The image die of  claim 39  wherein the material comprises a bimetallic plate, a shape memory metal, and/or an epoxy. 
   
   
       41 . The imager of  claim 33  wherein the flexor unit comprises an actuator attached to the backside of the substrate, and wherein the actuator moves to flex the substrate and bend the image sensor. 
   
   
       42 . A microelectronic workpiece, comprising:
 a substrate having a plurality of imager dies, wherein individual imager dies include an image sensor having a curved face and integrated circuitry operatively coupled to the image sensor; and   a cover over the substrate.   
   
   
       43 . The microelectronic workpiece of  claim 42 , further comprising a plurality of backside flexor units attached to a backside of the substrate under the image sensors, and wherein individual flexor units comprise:
 a first element, a spacer, and a plate, wherein at least the first element changes to bend the substrate under a corresponding image sensor.   
   
   
       44 . The microelectronic workpiece of  claim 43  wherein the first elements have a first coefficient of thermal expansion and the spacers have a different second coefficient of thermal expansion. 
   
   
       45 . The microelectronic workpiece of  claim 43  wherein the first elements are composed of a first compliant material and the spacers are composed of a second compliant material. 
   
   
       46 . The microelectronic workpiece of  claim 42 , further comprising a plurality of compartments attached to the backside of the substrate at corresponding imager dies, and wherein the compartments contain a fluid at a pressure that causes the substrate to flex under the image sensors. 
   
   
       47 . The microelectronic workpiece of  claim 46  wherein the fluid in the compartments is at a lower pressure than an ambient pressure. 
   
   
       48 . The microelectronic workpiece of  claim 46  wherein the fluid in the compartments is at a higher pressure than an ambient pressure. 
   
   
       49 . The microelectronic workpiece of  claim 42 , further comprising a material attached to the backside of the substrate under corresponding image sensors that bends the substrate locally under the image sensors. 
   
   
       50 . The microelectronic workpiece of  claim 49  wherein the material comprises an epoxy. 
   
   
       51 . The microelectronic workpiece of  claim 49  wherein the material comprises bimetallic plates and/or members made from a shape memory alloy. 
   
   
       52 . The microelectronic workpiece of  claim 42 , further comprising a standoffs between the cover and the substrate, sealed compartments over the image sensors, and a fluid in the compartments at a pressure that causes the substrate to bow locally at the image sensors. 
   
   
       53 . The microelectronic workpiece of  claim 51  wherein the fluid in the compartments is at a lower pressure than an ambient pressure. 
   
   
       54 . The microelectronic workpiece of  claim 51  wherein the fluid in the compartments is at a higher pressure than an ambient pressure. 
   
   
       55 . The microelectronic workpiece of  claim 42 , wherein the cover has a higher coefficient of thermal expansion from the substrate. 
   
   
       56 . The microelectronic workpiece of  claim 42 , further comprising a plurality of actuators attached to the backside of the substrate at the imager dies, wherein the actuators move local regions of the substrate to bow the substrate locally and flex the image sensors. 
   
   
       57 . The microelectronic workpiece of  claim 42 , further comprising a plurality of vacuum cups attached to the backside of the substrate, the individual vacuum cups having a curved interior surface adhered to the backside under a corresponding image sensor. 
   
   
       58 - 76 . (canceled) 
   
   
       77 . A microelectronic imager die comprising:
 a substrate having a front side and a back side;   a microelectronic image sensor having a face for receiving radiation at the front side of the substrate;   integrated circuitry in the substrate electrically connected to the image sensor; and   a curved flexor unit having a curved surface, wherein the backside of the substrate in the region of the image sensor is attached to the curved surface of the flexor unit such that the substrate in the region of the image sensor at least generally conforms to the curved surface.   
   
   
       78 . The die of  claim 77 , wherein the curved flexor unit comprises a vacuum cup having an opening through which a vacuum can be drawn. 
   
   
       79 . The die of  claim 77 , wherein the curved flexor unit comprises a vacuum cup having an opening through which a vacuum can be drawn, and wherein the backside of the substrate is adhered to the curved surface of the vacuum cup. 
   
   
       80 . The die of  claim 77 , wherein the curved flexor unit comprises a vacuum cup having the curved surface and interconnects, and wherein the substrate further comprises backside interconnects electrically coupled to interconnects of the curved flexor unit and the integrated circuitry.