Ag-based alloy wire for semiconductor package

Abstract

An Ag-based alloy wire for a semiconductor package is highly reliable and can be fabricated with low costs. The Ag-based alloy wire includes 0.05˜5 wt % of at least one kind of a first additive ingredient selected from the group consisting of platinum (Pt), palladium (Pd), rhodium (Rh), osmium (Os), gold (Au), and nickel (Ni), and Ag as a remainder.

1 . An Ag-based alloy wire for a semiconductor package, comprising 0.05˜5 wt % of at least one kind of a first additive ingredient selected from the group consisting of platinum (Pt), palladium (Pd), rhodium (Rh), osmium (Os), gold (Au), and nickel (Ni), and Ag as a remainder. 
     
     
         2 . The Ag-based alloy wire of  claim 1 , wherein the first additive ingredient comprises 0.05˜5 wt % of palladium (Pd). 
     
     
         3 . An Ag-based alloy wire for a semiconductor package comprising, 3 wtppm˜5 wt % of at least one kind of a second additive ingredient selected from the group consisting of copper (Cu), beryllium (Be), calcium (Ca), magnesium (Mg), barium (Ba), lanthanum (La), cerium (Ce), and yttrium (Y), and Ag as a remainder. 
     
     
         4 . The Ag-based alloy wire of  claim 3 , wherein the second additive ingredient comprises 0.1˜5 wt % of copper (Cu). 
     
     
         5 . The Ag-based alloy wire of  claim 3 , wherein the second additive ingredient comprises 3˜100 wtppm of at least one selected from the group consisting of beryllium (Be), calcium (Ca), magnesium (Mg), barium (Ba), lanthanum (La), cerium (Ce), and yttrium (Y). 
     
     
         6 . An Ag-based alloy wire for a semiconductor package, comprising 0.05˜5 wt % of at least one kind of a first additive ingredient selected from the group consisting of platinum (Pt), palladium (Pd), rhodium (Rh), osmium (Os), gold (Au), and nickel (Ni), 3 wtppm˜5 wt % of at least one kind of a second additive ingredient selected from the group consisting of copper (Cu), beryllium (Be), calcium (Ca), magnesium (Mg), barium (Ba), lanthanum (La), cerium (Ce), and yttrium (Y), and Ag as a remainder. 
     
     
         7 . The Ag-based alloy wire of  claim 6 , wherein the second additive ingredient comprises 0.1˜5 wt % of copper (Cu) or 3˜100 wtppm of at least one selected from the group consisting of beryllium (Be), calcium (Ca), magnesium (Mg), barium (Ba), lanthanum (La), cerium (Ce), and yttrium (Y).