Thermoplastic Resin Composition and Resin Molding

Abstract

The present invention provides a thermoplastic resin composition producing an extremely small amount of outgas and providing a molded article having excellent antistaticity. The present thermoplastic resin composition comprises a thermoplastic resin and is characterized in that the amount of outgas is 1500 μg/g or less. The composition may comprise a surface resistivity reducing substance in an amount of 0.1 to 70 parts by mass relative to 100 parts by mass of the thermoplastic resin. The present invention is suitable to a composition comprising a styrenic resin as the thermoplastic resin. The surface resistivity reducing substrate is preferably a polyamide elastomer comprising a hard segment formed of polyamide 12 and a soft segment formed of poly(alkylene oxide)glycol. The polyamide elastomer preferably has a refractive index of 1.5 to 1.53, a melting point of 130 to 160° C., a solution viscosity of 1.35 to 1.70 and a surface resistivity of 1×10 8 to 1×10 11 Ω.

1 . A thermoplastic resin composition comprising a thermoplastic resin (A), which has outgas in an amount of 1500 μg/g or less. 
   
   
       2 . The thermoplastic resin composition according to  claim 1 , further comprising a surface resistivity reducing substance (B) in an amount of 0.1 to 70 parts by mass relative to 100 parts by mass of the thermoplastic resin (A). 
   
   
       3 . The thermoplastic resin composition according to  claim 1 , in which the thermoplastic resin (A) comprises a styrenic resin. 
   
   
       4 . The thermoplastic resin composition according to  claim 1 , in which the surface resistivity reducing substrate (B) is a polyamide elastomer which comprises a hard segment comprising polyamide 12 and a soft segment comprising poly(alkylene oxide)glycol. 
   
   
       5 . The thermoplastic resin composition according to  claim 4 , in which the polyamide elastomer has a refractive index of 1.5 to 1.53, a melting point of 130 to 160° C., a solution viscosity of 1.35 to 1.7 and a surface resistivity of 1>10 8 to 1×10 11 Ω. 
   
   
       6 . An antistatic agent comprising a polyamide elastomer which comprises a hard segment comprising polyamide 12 and a soft segment comprising poly(alkylene oxide)glycol, in which the polyamide elastomer has a refractive index of 1.5 to 1.53, a melting point of 130 to 160° C., a solution viscosity of 1.35 to 1.7 and a surface resistivity of 1×10 8  to 1×10 11 Ω. 
   
   
       7 . A resinous molded article formed of the thermoplastic resin composition according to  claim 1 , in which the resinous molded article has a surface resistivity value of 1×10 11 Ω or less. 
   
   
       8 . The resinous molded article according to  claim 7 , which has a taber abrasion index of less than 30. 
   
   
       9 . The resinous molded article according to  claim 7 , which is a container used for receiving at least one selected from the group consisting of a semiconductor related component, a semiconductor related device, a liquid crystal related component and a liquid crystal related device. 
   
   
       10 . The thermoplastic resin composition according to  claim 2 , in which the thermoplastic resin (A) comprises a styrenic resin. 
   
   
       11 . The resinous molded article according to  claim 8 , which is a container used for receiving at least one selected from the group consisting of a semiconductor related component, a semiconductor related device, a liquid crystal related component and a liquid crystal related device.