US2008248602A1PendingUtilityA1
Light emitting device processes
Est. expiryJul 22, 2024(expired)· nominal 20-yr term from priority
H10P 90/1914H10H 20/018
52
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Abstract
Light-emitting devices, and related components, processes, systems and methods are disclosed.
Claims
exact text as granted — not AI-modified1 . A method of forming light emitting devices comprising:
providing a plurality of multi-layer stacks including a substrate, a sacrificial layer, and a light generating region, wherein the multi-layer stacks have a side of at least 1 mm; bonding the multi-layer stacks to a submount; removing the substrate, in part, by exposing the sacrificial layer of the multi-layer stacks to electromagnetic radiation; and forming respective light emitting devices from the multi-layer stacks.
2 . The method of claim 1 , wherein the electromagnetic radiation decomposes the sacrificial layer of the multi-layer stacks.
3 . The method of claim 1 , wherein the light emitting devices have a side of at least 1 mm.
4 . The method of claim 1 , wherein at least 50% of the total amount of light generated by the light-generating region that emerges from the light emitting devices is emitted through an upper surface of the multi-layer stacks.
5 . The method of claim 1 , comprising simultaneously exposing the sacrificial layer of the multi-layer stacks to electromagnetic radiation.
6 . The method of claim 1 , comprising sequentially exposing the sacrificial layer of the multi-layer stacks to electromagnetic radiation.
7 . The method of claim 1 , further comprising disposing a phosphor material layer over an upper surface of the multi-layer stacks.
8 . The method of claim 7 , wherein the phosphor material layer is compressed.
9 . The method of claim 7 , wherein the phosphor material layer has a thickness uniformity of less than about 20%.
10 . The method of claim 1 , wherein the sacrificial layer comprises a semiconductor material.
11 . The method of claim 1 , wherein the electromagnetic radiation passes through the substrate and is absorbed by the sacrificial layer.Cited by (0)
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