Polishing Slurry

Abstract

The present invention provides a polishing slurry which remarkably inhibits the occurrence of scratch, dishing or erosion. According to the present invention, provided is a polishing slurry comprising organic particles (A), an oxidizing agent and a complexing agent, wherein said organic particles (A) are those obtained by coating a part of the surface of an organic particle (B) having functional groups capable of reacting with a metal to be polished on the surface with a resin (C) free from functional groups capable of reacting with a metal to be polished, and the organic particle (B) is preferably one containing a copolymer obtained by polymerization of a monomer composition comprising 1 to 50 weight % of one, two or more monomers selected from a monomer having a carboxyl group, a monomer having a hydroxyl group, a monomer having an amino group, a monomer having an acetoacetoxy group and a monomer having a glycidyl group, and 99 to 50 weight % of other monomers, with each percentage based on the total weight of the monomers.

1 . A polishing slurry comprising organic particles (A), wherein said organic particles (A) are those obtained by coating a part of the surface of an organic particle (B) having functional groups capable of reacting with a metal to be polished on the surface with a resin (C) free from functional groups capable of reacting with a metal to be polished. 
   
   
       2 . The polishing slurry according to  claim 1 , further comprising an oxidizing agent. 
   
   
       3 . The polishing slurry according to  claim 1 , wherein said organic particle (B) contains a copolymer obtained by polymerization of a monomer composition comprising 1 to 50 weight % of one, two or more monomers selected from a monomer having a carboxylic acid group, a monomer having a hydroxyl group, a monomer having an amino group, a monomer having an acetoacetoxy group and a monomer having a glycidyl group, and 99 to 50 weight % of other monomers, with each percentage based on the total weight of the monomers. 
   
   
       4 . The polishing slurry according to  claim 1 , wherein the resin (C) contains a polymer of a styrene type monomer and/or a (meth) acrylic acid ester type monomer. 
   
   
       5 . The polishing slurry according to  claim 2 , wherein the polishing slurry further comprises at least one complexing agent selected from carboxylic acids, amines, amino acids and ammonia, and its pH is in the range of 5 to 11. 
   
   
       6 . The polishing slurry according to  claim 1 , wherein the oxidizing agent is hydrogen peroxide.