US2008253774A1PendingUtilityA1
Device having a casing containing a potting material for transmitting signals between electronic components
Est. expiryAug 12, 2023(expired)· nominal 20-yr term from priority
G06F 1/182H05K 1/0284G02B 6/4298H04M 1/0202H05K 2201/0999
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Claims
Abstract
A device including: at least two electronic/electrical components; and a casing, the casing having at least a portion thereof acting as a communication bus for connecting the at least two electronic/electrical components.
Claims
exact text as granted — not AI-modified1 - 41 . (canceled)
38 . A device comprising:
a casing, at least a portion of which contains a potting material; first and second electronic/electrical components, at least one of which is at least partially disposed in the potting material; a transmitter disposed on the first electronic/electrical component for transmitting a signal from the first electronic/electrical component and at least partially through the potting material; and a receiver disposed on the second electronic/electrical component for receiving the signal and transmitting the signal or representative of the signal to the second electronic/electrical component.
39 . The device of claim 38 , wherein the potting material is selected from a group consisting of a solid, a gel, and a liquid.
40 . The device of claim 39 , wherein the potting material is the solid and the solid is an epoxy resin.
41 . The device of claim 38 , wherein the signal is an infrared signal.
42 . The device of claim 38 , wherein the casing includes a window through which an input signal is transmitted from an exterior of the casing to at least one of the potting material, first electronic/electrical component, and second electronic/electrical component.
43 - 45 . (canceled)Cited by (0)
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