Method for Producing Metal Thin Body

Abstract

A method for producing a metal thin body by electroplating, in which the relative integrated intensity of the (111) plane of the metal thin body can be increased to 65% or greater. By carrying out electroplating using an electrolytic solution (plating solution) containing 5% in volume or greater of acetonitrile and water, in particular, using an electrolytic solution (plating solution) containing 10% in volume or greater of acetonitrile and water, the relative integrated intensity of the (111) plane can be increased to 65% or greater.

1 . A method for producing a metal thin body, wherein electroplating is carried out using an electrolytic solution containing 5% in volume or greater of acetonitrile and water. 
     
     
         2 . A method for producing a metal thin body having a relative integrated intensity of the (111) plane of 65% or greater, wherein electroplating is carried out using an electrolytic solution containing 10% in volume or greater of acetonitrile and water. 
     
     
         3 . The metal thin body producing method as recited in  claim 2 , wherein the concentration of acetonitrile in the electrolytic solution is regulated to a range of 10 to 22% in volume. 
     
     
         4 . The metal thin body producing method as recited in  claim 1 , wherein the metal of the metal thin body is a metal having a valence of two or greater, or alloys thereof, and among of them, the metal with the lowest valence is regulated to a concentration in the electrolytic solution in the range of 0 to 0.08 mol/L. 
     
     
         5 . The metal thin body producing method as recited in  claim 1 , wherein the metal of the metal thin body is a metal belonging to group Ib or group VIII, or alloys thereof. 
     
     
         6 . The metal thin body producing method as recited in  claim 1 , wherein electroplating is carried out using an electrolytic solution containing an additive in addition to acetonitrile and water. 
     
     
         7 . A metal thin body having a relative integrated intensity of the (111) plane 65% or greater obtained by the producing method as recited in  claim 4 . 
     
     
         8 . A plating solution containing acetonitrile and water. 
     
     
         9 . A method for producing a copper thin body having a relative integrated intensity of the (111) plane of 65% or greater, wherein electroplating is carried out using an electrolytic solution containing water and acetonitrile and copper sulfate, while at the same time, the concentration of acetonitrile in the electrolytic solution is regulated to 10 to 20% in volume, and, concentration of +1 copper ion in the electrolytic solution is regulated to 0 to 0.08 mol/L, and, the electrolytic potential of the electrolysis is regulated to more negative than −0.5V vs. SCE, and, the current density is regulated to 0.005 A/cm 2  or greater. 
     
     
         10 . A copper thin body having a relative integrated intensity of the (111) plane of 65% or greater obtained by the producing method as recited in  claim 9 . 
     
     
         11 . A circuit provided with a copper wiring having a relative integrated intensity of the (111) plane of 65% or greater.