US2008260573A1PendingUtilityA1
Ternary Ti-Ni-Cu Shape Memory Alloy and Process for Producing Same
Est. expiryJun 13, 2025(expired)· nominal 20-yr term from priority
C22C 1/11C22C 45/10C22F 1/006C22C 14/00C22F 1/18C22F 1/183C22C 30/02
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Claims
Abstract
An amorphous Ti—Ni—Cu alloy comprising from 44 to 49 atomic % of Ti, from 20 to 30 atomic % of Cu, and the balance being Ni and unavoidable elements is heated at 500 to 700° C. for a period of time not exceeding 100 hours to crystallize the amorphous alloy.
Claims
exact text as granted — not AI-modified1 - 5 . (canceled)
6 . A Ti—Ni—Cu shape memory alloy, containing Ti in amount of 44 atomic % to 49 atomic %, Cu in amount of 20 atomic % to 30 atomic % and the rest consisting of Ni and inevitable impurities, wherein TiNiCu phases or TiCu phases sized 500 nm or less precipitate in a Ti(Ni,Cu) crystal grain whose grain size is 2 μm or less.
7 . A method of producing a Ti—Ni—Cu shape memory alloy, wherein an amorphous Ti—Ni—Cu alloy, which contains Ti in amount of 44 atomic % to 49 atomic %, Cu in amount of 20 atomic % to 30 atomic % and the rest consisting of Ni and inevitable impurities, is crystallized by heat treatment.
8 . The method of producing a Ti—Ni—Cu shape memory alloy as claimed in claim 7 , wherein a temperature range of the heat treatment is 500° C. to 700° C.
9 . The method of producing a Ti—Ni—Cu shape memory alloy as claimed in claim 7 , wherein time of the heat treatment is not beyond 100 hours.
10 . The method of producing a Ti—Ni—Cu shape memory alloy as claimed in claim 8 , wherein time of the heat treatment is not beyond 100 hours.Join the waitlist — get patent alerts
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