Light set with heat dissipation means

Abstract

Disclosed is a light source, which includes a light-permeable casing, a thermoconductor, which is mounted inside the casing and has a flat end portion, a plurality of radiation fins fastened to the periphery of the thermoconductor inside the casing, a light source formed of an array of LEDs and installed in the flat end portion of the thermoconductor inside the casing, and a power unit mounted inside the casing to provide the light source with the necessary working voltage.

1 . A light set comprising:
 a cylindrical fluid containing thermoconductor having a flat end portion;   a plurality of heat dissipation fins defining mutually spaced radially extending faces and fastened to the periphery of said cylindrical thermoconductor to extend radially outward therefrom;   a light source installed on said flat end portion of thermoconductor, said light source including a planar substrate mounted on the flat end portion of said thermoconductor and a plurality of light emitting devices mounted on said planar substrate, wherein a positive electrode and a negative electrode mounted on said planar substrate electrically connected positive and negative terminals of the plurality of emitting devices;   a circuit board with positive and negative terminals electrically connected to the positive electrode and the negative electrode of the said planar substrate for controlling the operation of the plurality of light emitting devices; and   a power unit electrically connected to said light source through the circuit board to provide said light source with the necessary working power.   
   
   
       2 . The light set as claimed in  claim 1 , wherein each said heat dissipation fin has an annular shape extended around the periphery of said cylindrical thermoconductor. 
   
   
       3 . The light set as claimed in  claim 1 , further comprising a fan mechanism below said circuit board. 
   
   
       4 . The light set as claimed in  claim 3 , wherein said fan mechanism is electrically connected to said circuit board and controlled by a temperature detection and fan control circuit of said circuit board that detects ambient temperature level and controls on/off of said fan mechanism subject to the detection result. 
   
   
       5 . The light set as claimed in  claim 1 , wherein the planar substrate is semiconductor substrate. 
   
   
       6 . The light set as claimed in  claim 5 , the semiconductor substrate is Si substrate. 
   
   
       7 . The light set as claimed in  claim 1 , the plurality of light emitting devices are LED dies. 
   
   
       8 . A light set comprising:
 a heat pipe having a flat end portion and a periphery, and having capillary structure therein;   a plurality of heat dissipation fins defining mutually spaced radially extending faces and fastened to the periphery of said heat pipe to extend radially outward therefrom;   a light source installed on said flat end portion of said heat pipe, said light source including a planar substrate mounted on the flat end portion of said heat pipe and a plurality of light emitting devices mounted on said planar substrate, wherein a plurality of electrodes mounted on said planar substrate electrically connected the plurality of emitting devices; and   a circuit board with a plurality of terminals electrically connected to the plurality of electrodes of the said planar substrate for controlling the operation of the plurality of light emitting devices.   
   
   
       9 . The light set as claimed in  claim 8 , further comprising a power unit electrically connected to said light source through the circuit board to provide said light source with the necessary working power. 
   
   
       10 . The light set as claimed in  claim 8 , wherein each said light emitting device is a LED die or a LED package. 
   
   
       11 . The light set as claimed in  claim 1 , wherein the planar substrate is Si substrate. 
   
   
       12 . A light set comprising:
 a heat pipe having a flat end portion and a periphery, and having capillary structure therein;   a plurality of heat dissipation fins defining mutually spaced radially extending faces and fastened to the periphery of said heat pipe to extend radially outward therefrom;   a plurality of LED chips mounted on a planar substrate, the planar substrate having electrical circuits therein and being installed on said flat end portion of said heat pipe, a plurality of electrodes mounted on said planar substrate electrically connected the plurality of LED chips, wherein the plurality of LED chips are mounted on the planar substrate by wiring bonding or flip chip bonding; and   a protection device for securing the planar substrate on the flat end portion of said heat pipe.   
   
   
       13 . The light set as claimed in  claim 12 , wherein the planar substrate is a Si substrate. 
   
   
       14 . The light set as claimed in  claim 12 , further comprising a circuit board with a plurality of terminals electrically connected to the plurality of electrodes of the said planar substrate for controlling the operation of the plurality of light emitting devices. 
   
   
       15 . The light set as claimed in  claim 14 , each heat dissipation fin having at least one through hole formed in a radially extending face thereof offset from said periphery of said heat pipe for passage of electric conductors therethrough, the electric conductors electrically coupled between the planar substrate and the circuit board. 
   
   
       16 . A light set comprising:
 a heat pipe having a flat end portion and a periphery, and having capillary structure therein;   a plurality of heat dissipation fins defining mutually spaced radially extending faces and fastened to the periphery of said heat pipe to extend radially outward therefrom;   a plurality of LED chips mounted on a semiconductor substrate, the semiconductor substrate having electrical circuits therein and being installed on said flat end portion of said heat pipe, a plurality of electrodes mounted on said semiconductor substrate electrically connected the plurality of LED chips, wherein the plurality of LED chips are mounted on the planar substrate by wiring bonding or flip chip bonding; and   a protection device for securing the semiconductor substrate on the flat end portion of said heat pipe and isolating the plurality of LED chips from the air.   
   
   
       17 . The light set as claimed in  claim 16 , further comprising a circuit board with a plurality of terminals electrically connected to the plurality of electrodes of the said planar substrate for controlling the operation of the plurality of light emitting devices. 
   
   
       18 . The light set as claimed in  claim 17 , further comprising a power unit electrically connected to said light source through the circuit board to provide said light source with the necessary working power.