High density power distribution unit

Abstract

A power distribution unit may include a power distribution unit frame, where the power distribution unit frame has a 2U form factor, and where the power distribution unit frame is coupled to mount in an embedded computer frame. A plurality of power ingress sites may be coupled to a rear portion of the power distribution unit frame, where each of the plurality of power ingress sites has a current capacity of at least 100 amperes, where each of the plurality of power ingress sites includes an ingress pin coupled to interface with an ingress in-line, hyperboloid radial socket, and where the power distribution unit has a current capacity density of the plurality of power ingress sites of at least 600 amperes per power distribution unit.

1 . A method of supplying power to an embedded computer frame, comprising:
 providing a power distribution unit frame, wherein the power distribution unit frame has a 2U form factor, and wherein the power distribution unit frame is coupled to mount in the embedded computer frame; and   providing a plurality of power ingress sites coupled to a rear portion of the power distribution unit frame, wherein each of the plurality of power ingress sites has a current capacity of at least one hundred amperes, wherein each of the plurality of power ingress sites includes an ingress pin coupled to interface with an ingress in-line, hyperboloid radial socket, and wherein the power distribution unit has a current capacity density of the plurality of power ingress sites of at least six hundred amperes per power distribution unit.   
   
   
       2 . The method of  claim 1 , further comprising providing a plurality of power egress sites coupled to the rear portion, wherein at least a portion of the plurality of power egress sites has a current capacity of at least 100 amperes, and wherein each of the portion of the plurality of power egress sites includes an egress pin coupled to interface with an egress in-line, hyperboloid radial socket. 
   
   
       3 . The method of  claim 3  further comprising:
 providing a computing blade coupled to the embedded computer frame; and   at least one of the plurality of power egress sites providing power to the computing blade, wherein the computing blade requires at least 200 Watts.   
   
   
       4 . The method of  claim 1 , further comprising the power distribution unit providing power to an AdvancedTCA™ embedded computer frame. 
   
   
       5 . The method of  claim 1 , further comprising interposing at least one circuit breaker site between a power ingress site and a power egress site.