Adhesive tape adhering device for wafers and method of adhering adhesive tape on wafers

Abstract

An adhesive tape adhering device includes a table unit, a wafer bearing unit, an adhesive tape pull-tight unit, an adhesive tape clipping unit, and a rolling unit. The wafer bearing unit movably disposes on the table unit upwardly and downwardly for bearing a wafer. The adhesive tape pull-tight unit has a bundle of adhesive tape, and the adhesive tape pull-tight unit disposes on the table unit and next to one side of the wafer bearing unit. The adhesive tape clipping unit disposes on the table unit and next to the other side of the wafer bearing unit for tightly clipping an end side of a tape of the bundle of adhesive tape. The rolling unit slidably disposes on the table unit and next to the other side of the wafer bearing unit for uniformly rolling, pressing and adhering the adhesive tape on the at least one wafer

1 . An adhesive tape adhering device for wafers, comprising:
 a table unit;   a wafer bearing unit upward and downward movably disposed on the table unit for bearing at least one wafer;   an adhesive tape pull-tight unit having a bundle of adhesive tape, wherein the adhesive tape pull-tight unit is disposed on the table unit and next to one side of the wafer bearing unit;   an adhesive tape clipping unit disposed on the table unit and next to the other side of the wafer bearing unit for tightly clipping an end side of a tape of the bundle of adhesive tape; and   a rolling unit slidably disposed on the table unit and next to the other side of the wafer bearing unit for uniformly rolling, pressing and adhering the tape of the bundle of adhesive tape on the at least one wafer.   
     
     
         2 . The adhesive tape adhering device as claimed in  claim 1 , wherein the wafer bearing unit is composed of a wafer bearing disc and a hoist mechanism that is disposed under the wafer bearing disc for moving the wafer bearing disc upward and downward. 
     
     
         3 . The adhesive tape adhering device as claimed in  claim 2 , wherein the wafer bearing disc has an annular adhesive tape cutting groove formed thereon. 
     
     
         4 . The adhesive tape adhering device as claimed in  claim 3 , wherein a diameter of an inside surface of the annular adhesive tape cutting groove is same as a diameter of the at least one wafer. 
     
     
         5 . The adhesive tape adhering device as claimed in  claim 2 , wherein the wafer bearing disc has a plurality of concentric annular adhesive tape cutting grooves formed thereon. 
     
     
         6 . The adhesive tape adhering device as claimed in  claim 2 , wherein the wafer bearing disc is a wafer bearing sucker. 
     
     
         7 . The adhesive tape adhering device as claimed in  claim 6 , wherein the wafer bearing sucker has a vacuum hole for creating a vacuum function. 
     
     
         8 . The adhesive tape adhering device as claimed in  claim 1 , further comprising a temporary adhesive area disposed between the wafer bearing unit and the adhesive tape clipping unit for temporarily adhering the end side of the tape of the bundle of adhesive tape. 
     
     
         9 . The adhesive tape adhering device as claimed in  claim 8 , wherein the temporary adhesive area has a transverse adhesive tape cutting groove for cutting a spare part of the tape away. 
     
     
         10 . The adhesive tape adhering device as claimed in  claim 1 , further comprising a sliding mechanism disposed on the table unit for driving the rolling unit to move. 
     
     
         11 . A method of adhering adhesive tape on wafers, comprising:
 setting at least one wafer on a wafer bearing unit;   pulling out a tape with a predetermined length from an adhesive tape pull-tight unit, wherein the tape traverses the at least one wafer;   clipping an end side of the tape with an adhesive tape clipping unit;   driving the wafer bearing unit to move a predetermined distance upward so that the at least one wafer contacts a viscoid face of the tape;   rolling and pressing the tape in order to uniformly adhere the tape on the at least one wafer; and   cutting the tape along a periphery of the at least one wafer in order to remove the at least one wafer.   
     
     
         12 . The method as claimed in  claim 11 , wherein the wafer bearing unit is composed of a wafer bearing disc and a hoist mechanism that is disposed under the wafer bearing disc for moving the wafer bearing disc upward and downward. 
     
     
         13 . The method as claimed in  claim 12 , wherein the wafer bearing disc has an annular adhesive tape cutting groove formed thereon, and a diameter of an inside surface of the annular adhesive tape cutting groove is same as a diameter of the at least one wafer. 
     
     
         14 . The method as claimed in  claim 12 , wherein the wafer bearing disc has a plurality of concentric annular adhesive tape cutting grooves formed thereon. 
     
     
         15 . The method as claimed in  claim 12 , wherein the wafer bearing disc is a wafer bearing sucker. 
     
     
         16 . The method as claimed in  claim 15 , wherein the wafer bearing sucker has a vacuum hole for creating a vacuum function. 
     
     
         17 . The method as claimed in  claim 11 , wherein the tape has a predetermined tension acted thereon by a matching between the adhesive tape pull-tight unit and the adhesive tape clipping unit in order to maintain the surface planarization of the tape. 
     
     
         18 . The method as claimed in  claim 11 , wherein before the step of pulling out the tape with the predetermined length, the end side of the tape is adhered on a temporary adhesive area. 
     
     
         19 . The method as claimed in  claim 18 , wherein the temporary adhesive area has a transverse adhesive tape cutting groove for cutting a spare part of the tape. 
     
     
         20 . The method as claimed in  claim 19 , wherein after taking the at least one wafer out and cleaning a spare part of the tape, the wafer bearing unit, the adhesive tape clipping unit and the rolling unit are respectively returned to original places for performing a further adhesive tape adhering process.