Methods and apparatus for multiple temperature levels

Abstract

Methods and apparatus for thermal management according to various aspects of the present invention comprise a heat exchanger and one or more controllable thermal transfer elements. In one embodiment, the thermal transfer elements comprise thermoelectric coolers. The thermal transfer elements are thermally coupled to the heat exchanger. Components on a surface near the thermal transfer elements may be selectively cooled by controlling the thermal transfer elements.

1 . A thermal management system, comprising:
 a heat exchanger, comprising a first thermal transfer layer;   a second thermal transfer layer proximate the first thermal transfer layer; and   a thermal transfer element thermally coupled to the first thermal transfer layer and the second thermal transfer layer.   
   
   
       2 . The thermal management system of  claim 1 , wherein the heat exchanger defines a cooling channel, and wherein the first thermal transfer layer at least partially defines the cooling channel. 
   
   
       3 . The thermal management system of  claim 1 , wherein the thermal transfer element is sandwiched between the first thermal transfer layer and the second thermal transfer layer. 
   
   
       4 . The thermal management system of  claim 1 , further comprising a second thermal transfer element thermally coupled to the first thermal transfer layer and the second thermal transfer layer, wherein the first and second thermal transfer elements are associated with different thermal zones on the second thermal transfer layer. 
   
   
       5 . The thermal management system of  claim 4 , wherein the first and second thermal transfer elements are independently controllable. 
   
   
       6 . The thermal management system of  claim 1 , wherein each of the first and second thermal transfer layers comprise thermally conductive materials. 
   
   
       7 . The thermal management system of  claim 1 , wherein the second thermal transfer layer further includes a surface adapted for mounting a first electronic component and defining a first thermal zone. 
   
   
       8 . The thermal management system of  claim 7 , further comprising a second thermal transfer element, and wherein the second thermal transfer layer further includes a second area adapted for mounting a second electronic component and defining a second thermal zone, wherein the first thermal transfer element is adapted to transfer heat from the first thermal zone and the second thermal transfer element is adapted to transfer heat from the second thermal zone. 
   
   
       9 . The thermal management system of  claim 8 , wherein the first thermal zone and second thermal zone are adapted to generate different thermal energy levels. 
   
   
       10 . The thermal management system of  claim 8 , wherein the first thermal transfer element and the second thermal transfer element are independently controllable. 
   
   
       11 . The thermal management system of  claim 1 , wherein the thermal transfer element is controllable. 
   
   
       12 . A thermal management system, comprising:
 a first thermally conductive plate;   a second thermally conductive plate parallel to and proximate the first thermally conductive plate, wherein the first thermally conductive plate and the second thermally conductive plate define a cooling fluid channel;   a third thermally conductive plate parallel to and proximate the second thermally conductive plate; and   a plurality of controllable thermoelectric coolers disposed between and coupled to the second thermally conductive plate and the third thermally conductive plate, wherein the thermoelectric coolers define multiple individually controllable thermal zones on the third thermally conductive plate.   
   
   
       13 . The thermal management system of  claim 12 , wherein the third thermally conductive plate comprises further includes an area adapted for mounting a first electronic component in at least one of the thermal zones. 
   
   
       14 . The thermal management system of  claim 13 , wherein said thermal zones may generate different thermal energy levels. 
   
   
       15 . A method for thermal management of electronic components, comprising:
 transferring thermal energy from a first electronics component to a heat transfer medium through a first thermal transfer element;   transferring thermal energy from a second electronics component to the heat transfer medium through a second thermal transfer element;   monitoring a first temperature associated with the first electronics component and a second temperature associated with the second electronics component; and   independently adjusting the thermal transfer elements according to the monitored temperatures.   
   
   
       16 . The method for thermal management of  claim 15 , wherein the thermal transfer elements comprise thermoelectric coolers. 
   
   
       17 . The method for thermal management of  claim 15 , wherein the thermal transfer elements are disposed between and coupled to:
 a first thermally conductive layer coupled to the first and second electronic components; and   a second thermally conductive layer exposed to the heat transfer medium.   
   
   
       18 . The method for thermal management of  claim 15 , wherein the heat transfer medium is a coolant. 
   
   
       19 . The method for thermal management of  claim 15 , further comprising transferring energy from a third electronics component to the heat transfer medium via a thermal transfer layer. 
   
   
       20 . The method for thermal management of  claim 15 , wherein transferring thermal energy from the first electronics component to the heat transfer medium comprises:
 transferring the thermal energy through a first thermally conductive layer to the first thermoelectric cooler; and   transferring the thermal energy from the first thermoelectric cooler to the heat transfer medium through a second thermally conductive layer.