Method for Producing Patterned Structures by Printing a Surfactant Resist on a Substrate for Electrodeposition

Abstract

Methods for electrodeposition of conductive material on a conductive substrate that contains a pattern of a chemisorbed surfactant formed by a stamp having a patterned surface which is pressed onto the surface of the substrate for printing the substrate. Electrodeposition occurs by immersing the patterned substrate in a plating bath upon application of deposition potential or current to the conductive substrate. In embodiment, the chemisorbed surfactant on the surface of the substrate acts as a positive resist so that electrodeposition occurs on regions of the substrate not covered with surfactant. In another embodiment, electrodeposition occurs preferentially in regions of the substrate covered with the chemisorbed surfactant.

1 . A method for patterning a substrate with a conductive material, comprising the steps of:
 (a) providing a substrate;   (b) contacting the substrate with a stamp comprising a surfactant layer, wherein the surfactant chemisorbs to a portion of the substrate in contact with the stamp, thereby creating a surfactant-covered region and a surfactant-free region; and   (c) removing the stamp from the substrate; and   (d) electrodepositing a conductive material onto the substrate, whereby the conductive material adheres to the surfactant-free region of the substrate.   
     
     
         2 . The method of  claim 1 , wherein the stamp comprises polydimethylsiloxane (PDMS). 
     
     
         3 . The method of  claim 1 , wherein the surfactant layer is applied to the stamp by immersing the stamp into a solution comprising the surfactant. 
     
     
         4 . The method of  claim 3 , wherein the solution comprises alkane thiol CH 3 (CH 2 ) n SH. 
     
     
         5 . The method of  claim 1 , wherein the stamp comprises a nanoscale pattern. 
     
     
         6 . The method of  claim 1 , wherein the stamp comprises microscale pattern. 
     
     
         7 . The method of  claim 1  wherein electrodeposition occurs preferentially in areas of the surfactant-covered region. 
     
     
         8 . The method of  claim 1 , wherein the method is performed a plurality of times onto the same substrate. 
     
     
         9 . The method of  claim 8 , wherein a different conductive material is electrodeposited onto the substrate each time the method is performed. 
     
     
         10 . A method for patterning a substrate with conductive materials, comprising the steps of:
 (a) providing a substrate;   (b) contacting the substrate with a first stamp comprising a layer of a first surfactant, wherein the first surfactant chemisorbs to a portion of the substrate in contact with the stamp, thereby creating a first surfactant-covered region and a first surfactant-free region;   (c) removing the first stamp from the substrate;   (d) electrodepositing a first conductive material onto the substrate, whereby the conductive material adheres to the first surfactant-free region of the substrate;   (e) contacting the portion of the substrate comprising the first conductive material with a second stamp comprising a layer of a second surfactant, wherein the second surfactant chemisorbs onto the first conductive material in contact with the second stamp, thereby creating a second surfactant covered region on the first conductive material and a second surfactant-free region on the substrate;   (f) removing the second stamp from the substrate; and   (g) electrodepositing a second conductive material onto the substrate, whereby the second conductive material adheres to the second surfactant-free region.   
     
     
         11 . A method for patterning a conductive substrate, comprising the steps of:
 (a) providing a conductive substrate;   (b) contacting the substrate with a stamp comprising a surfactant layer, wherein the surfactant chemisorbs to the portion of the substrate in contact with the stamp, thereby creating a surfactant-covered region and a surfactant-free region; and   (c) removing the stamp from the conductive substrate.   
     
     
         12 . The method of  claim 11 , further comprising electrodepositing a conductive material onto the conductive substrate, whereby the conductive material adheres to the surfactant-free region of the substrate. 
     
     
         13 . The method of  claim 11 , wherein the stamp comprises polydimethylsiloxane (PDMS). 
     
     
         14 . The method of  claim 11 , wherein the surfactant layer is applied to the stamp by immersing the stamp into a solution comprising the surfactant. 
     
     
         15 . The method of  claim 14 , wherein the solution comprises alkane thiol CH 3 (CH 2 ) n SH. 
     
     
         16 . The method of  claim 11 , wherein the stamp comprises nanoscale feature(s). 
     
     
         17 . The method of  claim 11 , wherein the stamp comprises microscale feature(s) 
     
     
         18 . The method of  claim 12  wherein electrodeposition occurs preferentially in areas of the surfactant-covered region. 
     
     
         19 . The method of  claim 12 , wherein the method is performed a plurality of times onto the same substrate. 
     
     
         20 . The method of  claim 19 , wherein a different conductive material is electrodeposited onto the substrate each time the method is performed. 
     
     
         21 . A method for patterning a substrate with conductive materials comprising electrodepositing conductive materials onto a substrate comprising a chemisorbed surfactant.