Forming Mold Or Electroforming Mother Die Having Release Layer And Method For Manufacturing The Same

Abstract

The present invention provides a forming mold or electroforming mother die comprising a mold or mother die, and a release layer composed of an organic thin film on a mold surface or mother die surface which is formed by contacting the mold or mother die with an organic solvent solution comprising a silane surfactant represented by the formula [1] R n —Si—X 4-n   [1] (wherein, R represents an optionally substituted hydrocarbon group having 1 to 20 carbon atoms, an optionally substituted halogenated hydrocarbon group having 1 to 20 carbon atom, a hydrocarbon group having a linking group which has 1 to 20 carbon atoms, or a halogenated hydrocarbon group having a linking group which has 1 to 20 carbon atoms, and X represents a hydroxyl group, a halogen atom, an alkoxy group having 1 to 6 carbon atoms, or an acyloxy group, and n represents an integer of 1 to 3), and a catalyst capable of interacting with the silane surfactant, the release layer having excellent releasing properties and abrasion resistance, and a production method thereof.

1 . A forming mold or electroforming mother die comprising:
 (i) a mold or mother die; and   (ii) a release layer composed of an organic thin film on a mold surface or mother die surface which is formed by contacting the mold or mother die with an organic solvent solution comprising:
 a silane surfactant represented by the formula [1]
   R n —Si—X 4-n   [1] 
 
   
     wherein, R represents an is selected from the group consisting of optionally substituted hydrocarbon group having 1 to 20 carbon atoms, an optionally substituted halogenated hydrocarbon group having 1 to 20 carbon atoms, a hydrocarbon group having a linking group which has 1 to 20 carbon atoms, of and a halogenated hydrocarbon group having a linking group which has 1 to 20 carbon atoms; is selected from the group consisting of a hydroxyl group, a halogen atom, an alkoxy group having 1 to 6 carbon atoms, of and an acyloxy group; and n represents an integer of 1 to 3, and
 (iii) a catalyst capable of interacting with the silane surfactant. 
 
   
   
       2 . The forming mold or electroforming mother die according to  claim 1 , wherein the forming mold is a forming mold for molding resin. 
   
   
       3 . The forming mold or electroforming mother die according to  claim 1 , wherein the silane surfactant represented by the formula [1] is n-octadecyltrimethoxysilane. 
   
   
       4 . The forming mold or electroforming mother die according to  claim 1 , wherein the catalyst capable of interacting with the silane surfactant is at least one type of compound selected from the group consisting of metal oxides, metal hydroxides, metal alkoxides, metal compounds chelated or coordinated, partial hydrolysis products of metal alkoxide, hydrolysis products obtained by treating a metal alkoxide with water in an amount 2 times or more the equivalent of the metal alkoxide, organic acids; silanol condensation catalysts, of and acid catalysts. 
   
   
       5 . The forming mold or electroforming mother die according to  claim 1 , wherein the catalyst capable of interacting with the silane surfactant is a composition comprising
 (a) at least one type of compound selected from the group consisting of metal oxides, metal hydroxides, metal alkoxides, metal compounds chelated or coordinated, partial hydrolysis products of metal alkoxide, hydrolysis products obtained by treating a metal alkoxide with water in an amount 2 times or more the equivalent of the metal alkoxide, organic acids, silanol condensation catalysts, and acid catalysts; and   (b) the silane surfactant.   
   
   
       6 . The forming mold or electroforming mother die according to  claim 4 , wherein the metal alkoxide is titanium alkoxide. 
   
   
       7 . The forming mold or electroforming mother die according to  claim 5 , wherein the metal alkoxide is titanium alkoxide. 
   
   
       8 . The forming mold or electroforming mother die according to  claim 1 , wherein a moisture content of the organic solvent solution is set or maintained within the range from 50 ppm to the saturated moisture content of the organic solvent. 
   
   
       9 . The forming mold or electroforming mother die according to  claim 1 , wherein the mold or mother die is made of nickel, stainless, or glass. 
   
   
       10 . The forming mold or electroforming mother die according to  claim 2 , wherein the resin is an acrylic resin. 
   
   
       11 . The forming mold or electroforming mother die according to  claim 1 , wherein the mold or mother die is contacted with the organic solvent solution by immersing the mold or mother die in the organic solvent solution. 
   
   
       12 . The forming mold or electroforming mother die according to  claim 1 , wherein a fine pattern of μm-order or less is performed on the mold surface or mother die surface.