Reactive solder material

Abstract

Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.

1 . A method comprising:
 applying a reactive solder material to a semiconductor surface; and   soldering the reactive solder material to secure a thermal management device to the semiconductor surface in a fluxless manner.   
     
     
         2 . The method of  claim 1  wherein said soldering includes heating the reactive solder material to at least about a melting point of a base solder of the reactive solder material. 
     
     
         3 . The method of  claim 2  wherein the base solder is indium. 
     
     
         4 . The method of  claim 2  wherein the semiconductor surface is of a wafer surface, said method further comprising sawing the wafer into individual dice. 
     
     
         5 . A method comprising:
 applying a reactive solder material to a portion of a thermal management device; and   soldering the reactive solder material in a fluxless manner.   
     
     
         6 . The method of  claim 5  wherein said soldering is to secure a semiconductor surface to the thermal management device with the reactive solder material. 
     
     
         7 . The method of  claim 5  wherein the thermal management device is a first thermal management device, said soldering to secure the first thermal management device to a second thermal management device.